New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications
Paper i proceeding, 2006
Författare
Wen Xuan Wang
Xiuzhen Lu
Johan Liu
Chalmers, Mikroteknologi och nanovetenskap
Michael Olugbenga Olorunyomi
Tomas Aronsson
Dongkai Shangguan
8th IEEE International Conference on Electronic Materials and Packaging (EMAP)
631-635
Ämneskategorier
Elektroteknik och elektronik