New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications
Paper i proceeding, 2006

Författare

Wen Xuan Wang

Xiuzhen Lu

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2)

Michael Olugbenga Olorunyomi

Tomas Aronsson

Dongkai Shangguan

8th IEEE International Conference on Electronic Materials and Packaging (EMAP)

631-635

Ämneskategorier

Elektroteknik och elektronik

Mer information

Skapat

2017-10-06