New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications
Paper in proceedings, 2006

Author

Wen Xuan Wang

Xiuzhen Lu

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Michael Olugbenga Olorunyomi

Tomas Aronsson

Dongkai Shangguan

8th IEEE International Conference on Electronic Materials and Packaging (EMAP)

631-635

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017