New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications
Paper in proceeding, 2006
Author
Wen Xuan Wang
Xiuzhen Lu
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Michael Olugbenga Olorunyomi
Tomas Aronsson
Dongkai Shangguan
8th IEEE International Conference on Electronic Materials and Packaging (EMAP)
631-635
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering