Highly thermally conductive substrate based on graphene film
Paper i proceeding, 2021

Heat dissipation has become one of the critical challenges of development for microelectronic products because of the increasing of heat accumulation in the devices. A novel laminated composite with high thermal conductivity was fabricated by hot-pressing using graphene films (GFs) and glass fiber reinforced epoxy resin (GFEP). The effect of GFs with different thicknesses and number of layers on the thermal properties of the composites was investigated. An in-plane thermal conductivity of 141 W · m-1 · K-1 for the laminated composites with GFs and GFEP were obtained. The heat dissipation capability of GFs/GFEP composites is evaluated by infrared thermal imaging technology. The maximum temperature difference between the heating elements on GFs/GFEP composites and GFEP increases with the rise of voltage applied to the heating elements. Moreover, the heat dissipation capability of the composite is enhanced with the increased of the number of layers of GFs. The temperature of the heating element assembled on GFs/GFEP composites is 144.3°C lower than that on GFEP at the same voltage. The results indicate that the GFs/GFEP composites is a promising candidate of substrate material with high heat dissipation capability.

Thermal conductivity

Glass fibre reinforced epoxy resin

Heat dissipation

Graphene film


Zhen Lv

Shanghai University

Chenfei Zhou

Shanghai University

Xiuzhen Lu

Shanghai University

Johan Liu

Shanghai University

Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial

2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021

9780956808677 (ISBN)

23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Virtual, Online, Sweden,




Annan elektroteknik och elektronik



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