Thermally Conductive Graphene Film/Indium/Aluminum Laminated Composite by Vacuum Assisted Hot-pressing
Paper i proceeding, 2020

In order to meet the ever more demanding requirements of modern thermal management with the increasing high power density, an easy-fabricated laminated graphene film/indium/aluminum (GF/In/Al) composite was developed. The GF was fabricated through assemble graphene oxide (GO) sheets in a layer-by-layer structure and then subjected to graphitization process at high temperature as well as press forming process. The fabricated GF exhibits ultrahigh in-plane thermal conductivity together with good tensile strength. The GF/In/Al laminated composite was fabricated by hot-pressing indium coated GF and Al layers in vacuum environment. The indium layer was easily coated onto the GF due to its low melting point along with good flowing property. The thermal resistance measurements show that the indium bonding possess greater preponderance of reducing contact resistance than without bonding material and thermal conductive adhesive (TCA) bonding, because indium layer could fill the gap between GF and Al layers, and provide more stable connection. The results show that the obtained laminated composite could be potentially used in the thermal management of high power systems.

thermal resistance

lamination

hot-pressing

graphene film

Författare

Hao Liu

Shanghai University

Maomao Zhang

Shanghai University

Shujin Chen

Shanghai University

Nan Wang

SHT Smart High-Tech

Yong Zhang

Shanghai University

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Shanghai University

2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)

21st International Conference on Electronic Packaging Technology (ICEPT)
Guangzhou, China,

Ämneskategorier

Bearbetnings-, yt- och fogningsteknik

Materialkemi

Kompositmaterial och -teknik

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Senast uppdaterat

2021-05-17