Thermally Conductive Graphene Film/Indium/Aluminum Laminated Composite by Vacuum Assisted Hot-pressing
Paper in proceeding, 2020
thermal resistance
graphene film
lamination
hot-pressing
Author
Hao Liu
Shanghai University
Maomao Zhang
Shanghai University
Shujin Chen
Shanghai University
Nan Wang
SHT Smart High-Tech
Yong Zhang
Shanghai University
Johan Liu
Shanghai University
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
978-1-7281-6826-5 (ISBN)
Guangzhou, China,
Subject Categories (SSIF 2011)
Manufacturing, Surface and Joining Technology
Materials Chemistry
Composite Science and Engineering
DOI
10.1109/ICEPT50128.2020.9202623