Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA
Paper i proceeding, 2009
Författare
Cong Yue
Yan Zhang
Zhili Hu
Chalmers, Teknisk fysik, Elektronikmaterial
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
Zhaonian Cheng
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
851-855
Ämneskategorier (SSIF 2011)
Maskinteknik