Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA
Paper in proceedings, 2009

Author

Cong Yue

Zhili Hu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Zhaonian Cheng

Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

851-855

Subject Categories

Mechanical Engineering

More information

Created

10/7/2017