Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA
Paper in proceedings, 2009
Author
Cong Yue
Yan Zhang
Zhili Hu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Zhaonian Cheng
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
851-855
Subject Categories
Mechanical Engineering