Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA
Paper in proceeding, 2009
Author
Cong Yue
Yan Zhang
Zhili Hu
Chalmers, Applied Physics, Electronics Material and Systems
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Zhaonian Cheng
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
851-855
Subject Categories (SSIF 2011)
Mechanical Engineering