Yan Zhang

Showing 47 publications

2013

Characterization for Graphene as Heat Spreader Using Thermal Imaging Method

Shirong Huang, Yong Zhang, Shuangxi Sun et al
Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT), p. 403-408
Paper in proceedings
2013

Experimental study of Electrical properties and stability of CNT bumps in high density interconnects

Yan Zhang, Yingjie Zhou, Jingyu Fan et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 1085-1088
Paper in proceedings
2013

Experimental Study on the Mechanical Reliability of Carbon Nanotubes

Yan Zhang, Ling Wang, Jingyu Fan et al
Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT), p. 105-108
Paper in proceedings
2013

Reliability of Carbon Nanotube Bumps for Chip on Film Application

X. Li, Wei Mu, Di Jiang et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 845-848
Paper in proceedings
2012

Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material

Shuangxi Sun, Wei Mu, Yan Zhang et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging (Article number 6474593), p. 171-176
Paper in proceedings
2012

Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler

Yan Zhang, Huifeng Lv, Jing-yu Fan et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 1573-1577
Paper in proceedings
2012

Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate

Di Jiang, Yifeng Fu, Yan Zhang et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, Budapest, 25-27 September 2012, p. 213-216
Paper in proceedings
2010

Network for Observation of Volcanic and Atmospheric Change (NOVAC)-A global network for volcanic gas monitoring: Network layout and instrument description

Bo Galle, Mattias Erik Johansson, Claudia Rivera et al
Journal of Geophysical Research. Vol. 115 (D5), p. Art. no. D05304-
Journal article
2009

A Study of the Heat Transfer Characteristics of the Micro-channel Heat Sink

Shun Wang, Yan Zhang, Yifeng Fu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 255-259
Paper in proceedings
2009

Study of the filler effect of the effective thermal conductivity of thermal conductive adhesive

Yan Zhang, Cong Yue, Johan Liu et al
ICEP
Paper in proceedings
2009

The Dual-Beam mini-DOAS technique - measurements of volcanic gas emission, plume height and plume speed with a single instrument

Mattias Erik Johansson, Bo Galle, Yan Zhang et al
Bulletin of Volcanology. Vol. 71, p. 747-751
Journal article
2009

Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect Based on Micropolar Theory and Cohesive Zone Model

Yan Zhang, Jinyu Fan, Johan Liu
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 160-163
Paper in proceedings
2009

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Yi Fan, Xiaolong Zhong, Johan Liu et al
Microsystem Technologies. Vol. 15 (3), p. 375-381
Journal article
2009

Tomographic reconstruction of gas plumes using scanning DOAS

Mattias Erik Johansson, Bo Galle, Claudia Rivera et al
Bulletin of Volcanology. Vol. 71 (10), p. 1169-1178
Journal article
2009

Mobile mini-DOAS measurement of the outflow of NO2 and HCHO from Mexico City

Mattias Erik Johansson, Claudia Rivera, Benjamin de Foy et al
Atmospheric Chemistry and Physics. Vol. 9, p. 5647-5653
Journal article
2009

Influences of Filler Geometry and Content on Effective Thermal Conductivity of Thermal Conductive Adhesive

Cong Yue, Yan Zhang, Masahiro Inoue et al
2009 Electronic Components and Technology Conference, p. 2056-2059
Paper in proceedings
2009

Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging

Li Xu, Xiuzhen Lu, Johan Liu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1051-1053
Paper in proceedings
2009

Homogenization of Delamination Growth in an ACA Flip-chip Joint Based on Micropolar Theory

Yan Zhang, Ragnar Larsson
European Journal of Mechanics, A/Solids. Vol. 28, p. 433-444
Journal article
2009

Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA

Cong Yue, Yan Zhang, Zhili Hu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 851-855
Paper in proceedings
2009

FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives

Nabi Nabiollahi, Johan Liu, Zhili Hu et al
2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009; Genoa; Italy; 26 July 2009 through 30 July 2009, p. 422-425
Paper in proceedings
2009

Validation of optical remote sensing measurement strategies applied to industrial gas emissions

Claudia Rivera, Jose Antonio García, Bo Galle et al
International Journal of Remote Sensing. Vol. 30 (12), p. 3191-3204
Journal article
2008

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Yi Fan, Xiaolong Zhong, Johan Liu et al
Microsystem Technologies
Journal article
2008

Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection

Yan Zhang, Johan Liu, Ragnar Larsson et al
Journal of Adhesion Science and Technology. Vol. 22 (14), p. 1717-1731
Journal article
2008

Micropolar Cohesive Zone Model for Delamination Failure in Microsystem Interconnects

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Proceedings of the 22nd International Congress of Theoretical and Applied Mechanics
Paper in proceedings
2008

Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load

Yan Zhang, Johan Liu, Ragnar Larsson
Journal of Electronic Packaging, Transactions of the ASME. Vol. 130 (2), p. 0210101-0210107
Journal article
2008

Understanding BGA interconnect interface behaviour using Micropolar theory

Yan Zhang, Ragnar Larsson, Johan Liu
Journal of Electronics Packaging
Journal article
2007

A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

Johan Liu, Yan Zhang, Teng Wang
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceedings
2007

Large-eddy simulation of three-dimensional vortical structures for an impinging transverse jet in the near region

Jing-yu Fan, Yan Zhang, D. Z. Wang
Shuidonglixue Yanjiu yu Jinzhan / Journal of Hydrodynamics Ser. A. Vol. 19 (3), p. 314-321
Journal article
2007

Encapsulation of OLED device by Using Anisotropic Conductive Adhesive

Yan Zhang, Måns Andreasson, Hua Zhou et al
Proceedings of 2007 International Symposium on High Density Packaging and Microsystem Integration, p. 314-317
Paper in proceedings
2007

Micropolar Delamination Modelling for ACF Flip-chip Joints in Microsystem

Yan Zhang, Ragnar Larsson
Proceedings of the 20th Nordic Seminar on Computational Mechanics, 23-24 November, Gothenburg, Sweden
Conference contribution
2007

PBGA Interconnect Behavior under Thermal Effects

Yan Zhang, Johan Liu, Ragnar Larsson
Proceedings of International Conference on Electronics Packaging (ICEP2007), Tokyo, Japan, p. 329-334
Paper in proceedings
2007

Second order multi-scale micropolar model for microsystem interconnections

Yan Zhang, Johan Liu, Jing-yu Fan et al
Proceedings of the Fifth International Conference on Nonlinear Mechanics (ICNM-V), p. 1434-1439
Paper in proceedings
2007

Interface modelling microsystem interconnections using micropolar theory and discontinuous approximation

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Computers & Structures. Vol. 85 (19-20), p. 1500-1513
Journal article
2007

A Study of Effects of Different Coolants on On-chip Cooling with Carbon Nanotube Micro-fin Architectures by Using Computational Fluid Dynamics Simulation

Johan Liu, Yan Zhang, Teng Wang
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceedings
2007

Homogenization of microsystem interconnects based on micropolar theory and discontinuous kinematics

Ragnar Larsson, Yan Zhang
Journal of the Mechanics and Physics of Solids. Vol. 55, p. 819-841
Journal article
2006

Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 166-170
Paper in proceedings
2006

Higher Order Homogenization of a Microsystem Interface Based on Micropolar Theory

Ragnar Larsson, Yan Zhang
Proc. 6th European Solid Mechanics Conference (ESMC 2006), 28 Aug. - 1 Sept. 2006, Budapest, Hungary
Paper in proceedings
2006

Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Proc. 1 st Electronics Systemintegration Technology Conference, 2006 (ESTC 2006), 5 - 7 Sept. 2006, Dresden, Germany. Vol. 2, p. 757-761
Paper in proceedings
2006

Interface Modelling of ACA Interconnects Using Micropolar Theory

Yan Zhang, Ragnar Larsson, Johan Liu
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05; Shanghai; China; 27 June 2005 through 29 June 2005, p. Art. no. 4017426-
Paper in proceedings
2006

Understanding eruptive behavior by coupling SO2 emission and seismicity data at Popocatépetl volcano (México)

Claudia Rivera, Bo Galle, H. Delgado Granados et al
Cities on Volcanoes IV, Quito, 23-27 January, 2006
Conference poster
2005

Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation

Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Proc. The 5th Int. IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, (Polytronic 2005), October 23-26, Warsaw, Poland
Paper in proceedings
2005

Modelling of Carbon Nanotubes as Heat Sink Fins in Microchannels for Microelectronics Cooling

Lisa Ekstrand, Zhimin Mo, Yan Zhang et al
Proceedings of the IEEE CPMT Polytronic 05 Conference 2005, p. 185-187
Paper in proceedings
2005

Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation

Yan Zhang, Ragnar Larsson, Jingyu Fan et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp115-119
Paper in proceedings
2005

Numerical Simulation Based on CFD for Impingement Heat Transfer in Electronics Cooling

Yan Zhang, Jingyu Fan, Johan Liu
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp360-364
Paper in proceedings

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