Yan Zhang

Experimental Study on the Mechanical Reliability of Carbon Nanotubes

Experimental study of Electrical properties and stability of CNT bumps in high density interconnects

Reliability of Carbon Nanotube Bumps for Chip on Film Application

Characterization for Graphene as Heat Spreader Using Thermal Imaging Method

Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material

Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler

Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate

2010

Network for Observation of Volcanic and Atmospheric Change (NOVAC)-A global network for volcanic gas monitoring: Network layout and instrument description

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA

Homogenization of Delamination Growth in an ACA Flip-chip Joint Based on Micropolar Theory

Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging

Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect Based on Micropolar Theory and Cohesive Zone Model

Study of the filler effect of the effective thermal conductivity of thermal conductive adhesive

FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives

2009

Mobile mini-DOAS measurement of the outflow of NO2 and HCHO from Mexico City

Tomographic reconstruction of gas plumes using scanning DOAS

A Study of the Heat Transfer Characteristics of the Micro-channel Heat Sink

The Dual-Beam mini-DOAS technique - measurements of volcanic gas emission, plume height and plume speed with a single instrument

Influences of Filler Geometry and Content on Effective Thermal Conductivity of Thermal Conductive Adhesive

Validation of optical remote sensing measurement strategies applied to industrial gas emissions

Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Understanding BGA interconnect interface behaviour using Micropolar theory

Micropolar Cohesive Zone Model for Delamination Failure in Microsystem Interconnects

Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load

Interface modelling microsystem interconnections using micropolar theory and discontinuous approximation

Second order multi-scale micropolar model for microsystem interconnections

Encapsulation of OLED device by Using Anisotropic Conductive Adhesive

Large-eddy simulation of three-dimensional vortical structures for an impinging transverse jet in the near region

PBGA Interconnect Behavior under Thermal Effects

Micropolar Delamination Modelling for ACF Flip-chip Joints in Microsystem

Modelling and Reliability Assessment of Microsystem Interconnections

Homogenization of microsystem interconnects based on micropolar theory and discontinuous kinematics

A Study of Effects of Different Coolants on On-chip Cooling with Carbon Nanotube Micro-fin Architectures by Using Computational Fluid Dynamics Simulation

A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

Development and Implementation of a Wireless Sensor Network for Volcanic Gas Emission Monitoring

Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection

Interface Modelling of ACA Interconnects Using Micropolar Theory

Higher Order Homogenization of a Microsystem Interface Based on Micropolar Theory

Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging

Understanding eruptive behavior by coupling SO2 emission and seismicity data at Popocatépetl volcano (México)

Micropolar interface models for microsystem interconnections

Numerical Simulation Based on CFD for Impingement Heat Transfer in Electronics Cooling

Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation

Modelling of Carbon Nanotubes as Heat Sink Fins in Microchannels for Microelectronics Cooling

Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation