Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material
Paper in proceeding, 2012

The need for faster, smaller, more reliable and efficient products has resulted in increased heat generated in microelectronic components. Removal of the heat generated is an important issue in electronic packaging. Therefore, a novel Nano-Thermal Interface Material was developed to improve this. This paper aims at studying the thermal performance of the new nano-structured polymer-metal composite film (Nano-TIM) in application for dissipating around hot spots which exist in non-uniform power generation. Through semiconductor process and Micron-RTD principle, 5*5mm 2 thermal test chips were developed to serve as a heat source for detecting the heat dissipation effect of the Nano-TIM. T3Ster test system and IR Camera were used to measure partial thermal resistance of the 50 and 75 um Nano-TIM layer and study the spread of different hot spot positions in 10*10mm 2 power chip. We also studied the hot spot dissipation effect under different die attach areas with the Nano-TIM. According to the results of this study, this new class of Nano-TIM can meet the high requirements for hot spot dissipation of highly non-uniform power distribution in electronics packaging. © 2012 IEEE.


Shuangxi Sun

Shanghai University

Wei Mu

Chalmers, Applied Physics, Electronics Material and Systems

Yan Zhang

Shanghai University

Björn Carlberg

Chalmers, Applied Physics, Electronics Material and Systems

Lilei Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging

Article number 6474593 171-176
978-1-4673-1680-4 (ISBN)

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering





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