Björn Carlberg

Showing 29 publications

2012

Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material

Shuangxi Sun, Wei Mu, Yan Zhang et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging (Article number 6474593), p. 171-176
Paper in proceedings
2012

Polymer-metal nanofibrous composite for thermal management of microsystems

Björn Carlberg, L. Ye, Johan Liu
Materials Letters. Vol. 75, p. 229-232
Journal article
2012

Thermal performance characterization of nano thermal interface materials after power cycling

S. Sun, L. Xin, Carl Zandén et al
Proceedings - Electronic Components and Technology Conference, p. 1426-1430
Paper in proceedings
2012

Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene

Yifeng Fu, Björn Carlberg, Niklas Lindahl et al
Advanced Materials. Vol. 24 (12), p. 1576-1581
Journal article
2012

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Yifeng Fu, N. Nabiollahi, Teng Wang et al
Nanotechnology. Vol. 23 (4)
Journal article
2012

Reliability investigation of nano-enhanced thermal conductive adhesives

Nan Wang, Murali Murugesan, L. Ye et al
Proceedings of the IEEE Conference on Nanotechnology
Paper in proceedings
2012

A method to integrate patterned electrospun fibers with microfluidic systems to generate complex microenvironments for cell culture applications

Patric Wallin, Carl Zandén, Björn Carlberg et al
Biomicrofluidics. Vol. 6 (2)
Journal article
2012

Patterned electrospun microfibers integrated in a microfluidic system to study cells in complex microenvironments

Patric Wallin, Carl Zandén, Björn Carlberg et al
eCM Journal. Vol. 23 (Supplement 5), p. 65-
Conference poster
2011

Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures

L. Zhang, X. Lu, Xin Luo et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 426-429
Paper in proceedings
2011

Surface-Confined Synthesis of Silver Nanoparticle Composite Coating on Electrospun Polyimide Nanofibers

Björn Carlberg, L. Ye, Johan Liu
Small. Vol. 7 (21), p. 3057-3066
Journal article
2010

Nanofiber based composites for thermal management

Johan Liu, Björn Carlberg
International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference
Conference contribution
2010

Polymer nanofiber based continuous metal phase composite for thermal management applications

Björn Carlberg, Johan Liu, L. Ye
3rd Electronics System Integration Technology Conference, ESTC 2010; Berlin; Germany; 13 September 2010 through 16 September 2010, p. Art. no. 5642950-
Paper in proceedings
2010

Direct Photolithographic Patterning of Electrospun Films for Defined Nanofibrillar Microarchitectures

Björn Carlberg, Teng Wang, Johan Liu
Langmuir. Vol. 26 (4), p. 2235-2239
Journal article
2010

Interpenetrating phase polymer-metal composite for thermal interface material applications

Björn Carlberg, Johan Liu
IEEE CPMT Electronics System Integration Conference (ESTC)
Conference contribution
2009

Modeling of Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications

Zhili Hu, Björn Carlberg, Cong Yue et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 481-484
Paper in proceedings
2009

Polymer-metal nano-composite films for thermal management

Björn Carlberg, Teng Wang, Johan Liu et al
Microelectronics International. Vol. 26 (2), p. 28-36
Journal article
2009

Evaluation of new and improved thermal interface materials and surface roughness effect on thermal interface resistance

Carl Zandén, Björn Carlberg, Johan Liu
Proceedings of the The International 3rd Swedish Production Symposium (SPS), p. 88-96
Paper in proceedings
2009

Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells.

Björn Carlberg, Mathilda Zetterström Axell, Ulf Nannmark et al
Biomedical Materials (Bristol). Vol. 4 (4), p. 45004-
Journal article
2009

Stem Cell Growth and Migration on Nanofibrous Polymer Scaffolds and Micro-Fluidic Channels on Silicon-Chip

Johan Liu, Hans-Georg Kuhn, Jing Yujia et al
Proceedings of the 2009 Electronic Components and Technology Conference, p. 1080-1085
Paper in proceedings
2008

Preparation of Polymer-metal Nanocomposite Films and Performance Evaluation as Thermal Interface Material

Björn Carlberg, Teng Wang, Yifeng Fu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1395-1400
Paper in proceedings
2008

Recent Progress of Thermal Interface Materials

Johan Liu, Teng Wang, Björn Carlberg et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 351-358
Paper in proceedings
2008

Nanostructured Polymer-metal Composite for Thermal Interface Material Applications

Björn Carlberg, Teng Wang, Yifeng Fu et al
proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC), p. 191-197
Paper in proceedings
2008

Development of Nanomaterials and Devices for Electronics Cooling and Interconnect

Johan Liu, Teng Wang, Björn Carlberg et al
Proceedings of the Ecology in Electronics Conference in “Progress in Eco-Electronics”, as Monongraphies of Tele, Radio Institute, p. 33-47
Book chapter
2007

Electrospun Nano-fibrous Polymer Films with Barium Titanate Nanoparticles for Embedded Capacitor Applications

Björn Carlberg, Jonas Norberg, Johan Liu
proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC)
Paper in proceedings
2007

Development and Characterization of Carbon Nanotube-based Bumps for Ultra Fine Pitch Flip Chip Interconnection

Teng Wang, Björn Carlberg, Johan Liu
Proceedings of the 16th European Microelectronics and Packaging Conference & Exhibition: EMPC2007
Paper in proceedings
2007

Investigation of Dielectric Strength of Electrospun Nanofiber Based Thermal Interface Material

Johan Liu, Björn Carlberg
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceedings
2007

Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive

Teng Wang, Björn Carlberg, Martin Jonsson et al
Applied Physics Letters. Vol. 91 (9), p. 093123-
Journal article

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