Development and Characterization of Carbon Nanotube-based Bumps for Ultra Fine Pitch Flip Chip Interconnection
Paper in proceeding, 2007

Author

Teng Wang

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Björn Carlberg

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Proceedings of the 16th European Microelectronics and Packaging Conference & Exhibition: EMPC2007

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

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Created

10/6/2017

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