Development and Characterization of Carbon Nanotube-based Bumps for Ultra Fine Pitch Flip Chip Interconnection
Paper in proceedings, 2007

Author

Teng Wang

Chalmers, Microtechnology and Nanoscience (MC2)

Björn Carlberg

Chalmers, Microtechnology and Nanoscience (MC2)

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the 16th European Microelectronics and Packaging Conference & Exhibition: EMPC2007

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017