Teng Wang

Carbon Nanotubes for thermal management of Microsystems

Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application

Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration

Selective growth of double-walled carbon nanotubes on gold films

Formation of three-dimensional carbon nanotube structures by controllable vapor densification

Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Low Partial Pressure Chemical Vapor Deposition of Graphene on Copper

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

2012

Controllable chemical vapor deposition of large area uniform nanocrystalline graphene directly on silicon dioxide

Benchmarking assembly materials for vertically aligned carbon nanotubes into microsystems

Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration

Integration of vertically-aligned carbon nanotubes into microsystems: a packaging perspective

Direct Photolithographic Patterning of Electrospun Films for Defined Nanofibrillar Microarchitectures

Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film

Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly

Future Emerging Packaging Technology Using Carbon Nanotubes

Application of through silicon via technology for in situ temperature monitoring on thermal interfaces

Dry densification of carbon nanotube bundles

Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill

Use of carbon nanotubes in potential electronics packaging applications

Thermal management technologies for electronics based on multiwalled carbon nanotube bundles: As power consumption increases, so does the need for more efficient heat removal technologies

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Through silicon vias filled with planarized carbon nanotube bundles

Stem Cell Growth and Migration on Nanofibrous Polymer Scaffolds and Micro-Fluidic Channels on Silicon-Chip

Towards Carbon Nanotube-based off-Chip Interconnects

Carbon Nanotubes as Cooling Fins in Microelectronic Systems

Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg

Polymer-metal nano-composite films for thermal management

Development of a test platform for thermal characterization using through-silicon-via technology

3D chip stacking using planarized carbon nanotubes as through-silicon-vias

Nanostructured Polymer-metal Composite for Thermal Interface Material Applications

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Development of Nanomaterials and Devices for Electronics Cooling and Interconnect

A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers

Preparation of Polymer-metal Nanocomposite Films and Performance Evaluation as Thermal Interface Material

Overview of Carbon Nanotubes as Off-Chip Interconnects

A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers

Recent Progress of Thermal Interface Materials

Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant

Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging

Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive

A Study of Effects of Different Coolants on On-chip Cooling with Carbon Nanotube Micro-fin Architectures by Using Computational Fluid Dynamics Simulation

A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

Development and Characterization of Carbon Nanotube-based Bumps for Ultra Fine Pitch Flip Chip Interconnection

Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection

Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection

Development and Characterization of Microcoolers using Carbon Nanotubes

Development and Characterization of Microcoolers using Carbon Nanotubes

Computational Fluid Dynamics Simulation for On-chip Cooling with Carbon Nanotube Micro-fin Architectures