Teng Wang

Showing 50 publications

2013

Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration

Johan Liu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (1), p. 13-27
Journal article
2012

Low Partial Pressure Chemical Vapor Deposition of Graphene on Copper

Jie Sun, Niclas Lindvall, Matthew Cole et al
IEEE Transactions on Nanotechnology. Vol. 11 (2), p. 255-260
Journal article
2012

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

Kjell Jeppson, Teng Wang, Di Jiang et al
IEEE Electron Device Letters. Vol. 33 (3), p. 420-422
Journal article
2012

Formation of three-dimensional carbon nanotube structures by controllable vapor densification

Teng Wang, Di Jiang, Si Chen et al
Materials Letters. Vol. 78, p. 184-187
Journal article
2012

Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application

Di Jiang, Teng Wang, Si Chen et al
Microelectronic Engineering. Vol. 103, p. Pages 177-180
Journal article
2012

Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology

Di Jiang, Teng Wang, Lilei Ye et al
ECS Transactions. Vol. 44 (1), p. 683-692
Paper in proceedings
2012

Controllable chemical vapor deposition of large area uniform nanocrystalline graphene directly on silicon dioxide

Jie Sun, Niclas Lindvall, M. T. Cole et al
Journal of Applied Physics. Vol. 111 (4)
Journal article
2012

Selective growth of double-walled carbon nanotubes on gold films

Yifeng Fu, Si Chen, Johan Bielecki et al
Materials Letters. Vol. 72, p. 78-80
Journal article
2012

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Yifeng Fu, N. Nabiollahi, Teng Wang et al
Nanotechnology. Vol. 23 (4)
Journal article
2011

Benchmarking assembly materials for vertically aligned carbon nanotubes into microsystems

Teng Wang, Nabi Nabiollahi, Kjell Jeppson et al
CD Proceedings of the Annual World Conference on Carbon, ECUST, Shanghai, China, July 25-29, 2011, Paper no: 740
Paper in proceedings
2011

Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration

Teng Wang, Kjell Jeppson, L. Ye et al
Small. Vol. 7 (16), p. 2313-2317
Journal article
2010

Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill

Xingrui Chen, Teng Wang, Joachim Nurnus et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582779), p. 1250-1254
Paper in proceedings
2010

Use of carbon nanotubes in potential electronics packaging applications

Johan Liu, Teng Wang, Yifeng Fu et al
2010 10th IEEE Conference on Nanotechnology, NANO 2010, p. 160-166
Conference contribution
2010

Dry densification of carbon nanotube bundles

Teng Wang, Kjell Jeppson, Johan Liu
Carbon. Vol. 48 (13), p. 3795-3801
Journal article
2010

Future Emerging Packaging Technology Using Carbon Nanotubes

Johan Liu, Yiheng Qin, Carl Zandén et al
ELTE 2010 & 34th IMAPS-CPMT
Conference contribution
2010

Direct Photolithographic Patterning of Electrospun Films for Defined Nanofibrillar Microarchitectures

Björn Carlberg, Teng Wang, Johan Liu
Langmuir. Vol. 26 (4), p. 2235-2239
Journal article
2010

Application of through silicon via technology for in situ temperature monitoring on thermal interfaces

Yifeng Fu, Teng Wang, Ove Jonsson et al
Journal of Micromechanics and Microengineering. Vol. 20 (2), p. id 025027 (5 pp)-
Journal article
2010

Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film

Xia Zhang, Teng Wang, Pär Berggren et al
ECS Transactions. Vol. 27 (1), p. 825-830
Paper in proceedings
2010

Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly

Yifeng Fu, Yiheng Qin, Teng Wang et al
Advanced Materials. Vol. 22 (44), p. 5039-5042
Journal article
2009

Polymer-metal nano-composite films for thermal management

Björn Carlberg, Teng Wang, Johan Liu et al
Microelectronics International. Vol. 26 (2), p. 28-36
Journal article
2009

Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg

Yifeng Fu, Teng Wang, Johan Liu
Proceedings of the Annual Nordic Conference, p. 35-38
Paper in proceedings
2009

3D chip stacking using planarized carbon nanotubes as through-silicon-vias

Kjell Jeppson, Teng Wang, Johan Liu et al
Swedish System on Chip Conference
Conference contribution
2009

Towards Carbon Nanotube-based off-Chip Interconnects

Teng Wang
Licentiate thesis
2009

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Yi Fan, Xiaolong Zhong, Johan Liu et al
Microsystem Technologies. Vol. 15 (3), p. 375-381
Journal article
2009

Carbon Nanotubes as Cooling Fins in Microelectronic Systems

Yifeng Fu, Teng Wang, Johan Liu et al
Proceedings of the 9th Nanotechnology Conference, p. 10-14
Paper in proceedings
2009

Through silicon vias filled with planarized carbon nanotube bundles

Teng Wang, Kjell Jeppson, Niklas Olofsson et al
Nanotechnology. Vol. 20 (48), p. 485203-
Journal article
2009

Development of a test platform for thermal characterization using through-silicon-via technology

Yifeng Fu, Teng Wang, Johan Liu
IMAPS Nordic Annual Conference 2009; Tonsberg; Norway; 13 September 2009 through 15 September 2009, p. 35-38
Paper in proceedings
2009

Stem Cell Growth and Migration on Nanofibrous Polymer Scaffolds and Micro-Fluidic Channels on Silicon-Chip

Johan Liu, Hans-Georg Kuhn, Jing Yujia et al
Proceedings of the 2009 Electronic Components and Technology Conference, p. 1080-1085
Paper in proceedings
2008

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Yi Fan, Xiaolong Zhong, Johan Liu et al
Microsystem Technologies
Journal article
2008

Carbon Nanotubes for thermal management of Microsystems

Johan Liu, Teng Wang
Nanopackaging, p. 377-394
Book chapter
2008

Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging

Johan Liu, Yifeng Fu, Teng Wang
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. E3-01
Paper in proceedings
2008

A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers

Yi Fan, Yifeng Fu, Yan Zhang et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. D1-05
Paper in proceedings
2008

Preparation of Polymer-metal Nanocomposite Films and Performance Evaluation as Thermal Interface Material

Björn Carlberg, Teng Wang, Yifeng Fu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1395-1400
Paper in proceedings
2008

Overview of Carbon Nanotubes as Off-Chip Interconnects

Xia Zhang, Teng Wang, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference
Paper in proceedings
2008

A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers

Yi Fan, Yifeng Fu, Yan Zhang et al
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008
Paper in proceedings
2008

Recent Progress of Thermal Interface Materials

Johan Liu, Teng Wang, Björn Carlberg et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 351-358
Paper in proceedings
2008

Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant

Yi Fan, Yifeng Fu, Teng Wang et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1391-1394
Paper in proceedings
2008

Nanostructured Polymer-metal Composite for Thermal Interface Material Applications

Björn Carlberg, Teng Wang, Yifeng Fu et al
proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC), p. 191-197
Paper in proceedings
2008

Development of Nanomaterials and Devices for Electronics Cooling and Interconnect

Johan Liu, Teng Wang, Björn Carlberg et al
Proceedings of the Ecology in Electronics Conference in “Progress in Eco-Electronics”, as Monongraphies of Tele, Radio Institute, p. 33-47
Book chapter
2007

A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

Johan Liu, Yan Zhang, Teng Wang
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceedings
2007

Development and Characterization of Carbon Nanotube-based Bumps for Ultra Fine Pitch Flip Chip Interconnection

Teng Wang, Björn Carlberg, Johan Liu
Proceedings of the 16th European Microelectronics and Packaging Conference & Exhibition: EMPC2007
Paper in proceedings
2007

Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive

Teng Wang, Björn Carlberg, Martin Jonsson et al
Applied Physics Letters. Vol. 91 (9), p. 093123-
Journal article
2007

A Study of Effects of Different Coolants on On-chip Cooling with Carbon Nanotube Micro-fin Architectures by Using Computational Fluid Dynamics Simulation

Johan Liu, Yan Zhang, Teng Wang
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper in proceedings
2006

Computational Fluid Dynamics Simulation for On-chip Cooling with Carbon Nanotube Micro-fin Architectures

Xiaolong Zhong, Yan Zhang, Teng Wang et al
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), p. 117-123
Paper in proceedings
2006

Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection

Teng Wang
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany
Paper in proceedings
2006

Development and Characterization of Microcoolers using Carbon Nanotubes

Teng Wang, Martin Jönsson, Zhimin Mo et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 881-885
Paper in proceedings
2006

Development and Characterization of Microcoolers using Carbon Nanotubes

Teng Wang
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany
Paper in proceedings
2006

Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection

Teng Wang, Martin Jönsson, Eleanor E B Campbell et al
1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. Vol. 2, p. 892-895
Paper in proceedings

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