Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill
Paper in proceeding, 2010

Miniaturized thermoelectric coolers is one of the most promising active heat dissipating methods in hot spot cooling, laser cooling and other applications. Improving mechanical strength can potentially boost the reliability of this technology. In this paper, simulations and mechanical compression experiments were carried out on miniaturized thermoelectric coolers both with and without underfiller. The results of the simulations and experiments indicate that the underfill process technology is highly effective means to improve the mechanical strength of miniaturized thermoelectric coolers.


Xingrui Chen

Chalmers, Microtechnology and Nanoscience (MC2)

Teng Wang

Chalmers, Applied Physics, Electronics Material and Systems

Joachim Nurnus


Mike Benkendorf


Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010

Article number 5582779 1250-1254
978-142448142-2 (ISBN)

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Physical Sciences





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