Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill
Paper i proceeding, 2010

Miniaturized thermoelectric coolers is one of the most promising active heat dissipating methods in hot spot cooling, laser cooling and other applications. Improving mechanical strength can potentially boost the reliability of this technology. In this paper, simulations and mechanical compression experiments were carried out on miniaturized thermoelectric coolers both with and without underfiller. The results of the simulations and experiments indicate that the underfill process technology is highly effective means to improve the mechanical strength of miniaturized thermoelectric coolers.

Författare

Xingrui Chen

Chalmers, Mikroteknologi och nanovetenskap (MC2)

Teng Wang

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Joachim Nurnus

Micropelt GmbH

Mike Benkendorf

Micropelt GmbH

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010

1250-1254

Ämneskategorier

Fysik

DOI

10.1109/ICEPT.2010.5582779

ISBN

978-142448142-2