Teng Wang
Visar 50 publikationer
Carbon Nanotubes for thermal management of Microsystems
Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration
Low Partial Pressure Chemical Vapor Deposition of Graphene on Copper
Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests
Formation of three-dimensional carbon nanotube structures by controllable vapor densification
Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology
Selective growth of double-walled carbon nanotubes on gold films
A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity
Integration of vertically-aligned carbon nanotubes into microsystems: a packaging perspective
Benchmarking assembly materials for vertically aligned carbon nanotubes into microsystems
Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration
Use of carbon nanotubes in potential electronics packaging applications
Dry densification of carbon nanotube bundles
Future Emerging Packaging Technology Using Carbon Nanotubes
Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film
Polymer-metal nano-composite films for thermal management
Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg
3D chip stacking using planarized carbon nanotubes as through-silicon-vias
Carbon Nanotubes as Cooling Fins in Microelectronic Systems
Through silicon vias filled with planarized carbon nanotube bundles
Development of a test platform for thermal characterization using through-silicon-via technology
Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging
A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers
Overview of Carbon Nanotubes as Off-Chip Interconnects
A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers
Recent Progress of Thermal Interface Materials
Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant
Nanostructured Polymer-metal Composite for Thermal Interface Material Applications
Development of Nanomaterials and Devices for Electronics Cooling and Interconnect
A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array
Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive
Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection
Development and Characterization of Microcoolers using Carbon Nanotubes
Development and Characterization of Microcoolers using Carbon Nanotubes
Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection
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