Towards Carbon Nanotube-based off-Chip Interconnects
Licentiatavhandling, 2009

densification

through silicon via (TSV)

transfer

carbon nanotube (CNT)

planarization

interconnect

Fasrummet
Opponent: Krisztián Kordás

Författare

Teng Wang

Chalmers, Mikroteknologi och nanovetenskap (MC2)

Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive

Applied Physics Letters,; Vol. 91(2007)p. 093123-

Artikel i vetenskaplig tidskrift

Ämneskategorier

Elektroteknik och elektronik

Technical report MC2 - Department of Microtechnology and Nanoscience, Chalmers University of Technology

Fasrummet

Opponent: Krisztián Kordás