Towards Carbon Nanotube-based off-Chip Interconnects
Licentiate thesis, 2009
densification
through silicon via (TSV)
transfer
carbon nanotube (CNT)
planarization
interconnect
Author
Teng Wang
Chalmers, Microtechnology and Nanoscience (MC2)
Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive
Applied Physics Letters,;Vol. 91(2007)p. 093123-
Journal article
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
Technical report MC2 - Department of Microtechnology and Nanoscience, Chalmers University of Technology
Fasrummet
Opponent: Krisztián Kordás