Development of a test platform for thermal characterization using through-silicon-via technology
Paper i proceeding, 2009

In order to look into the heat transfer mechanism and improve the thermal performance of an electronic component, a thermal test platform has been designed and fabricated. A series of micro-machining processes have been developed to make the test platform. The Through-Silicon-Via technique using Cu as a conductor has been used to fabricate the temperature sensors in order to realize an in-situ temperature monitoring on a thermal interface. Pt-based temperature sensor array has been deposited on the chip and calibrated by an industry standard RTD. Results show that the Pt sensors work well which demonstrates the successful deposition of temperature sensing materials and good interconnection between through-hole vias and IC components. This indicates that the test platform can be used for thermal interface material characterization as well as 3D electronics reliability studies.


Thermal characterization


Test platform


Yifeng Fu

Chalmers, Teknisk fysik, Elektronikmaterial

Teng Wang

Chalmers, Teknisk fysik, Elektronikmaterial

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial

IMAPS Nordic Annual Conference 2009; Tonsberg; Norway; 13 September 2009 through 15 September 2009

978-162276183-8 (ISBN)


Industriell bioteknik



Mer information