Yifeng Fu

2021

Degradation of Carbon Nanotube Array Thermal Interface Materials through Thermal Aging: Effects of Bonding, Array Height, and Catalyst Oxidation

2020

Graphene related materials for thermal management

2020

Effects of high temperature treatment of carbon nanotube arrays on graphite: increased crystallinity, anchoring and inter-tube bonding

Scalable three-dimensional Ni3P-based composite networks for flexible asymmertric supercapacitors

2020

Synthesis of graphene quantum dots and their applications in drug delivery

2020

High porosity and light weight graphene foam heat sink and phase change material container for thermal management

2020

Multiple growth of graphene from a pre-dissolved carbon source

Graphene based thermal management system for battery cooling in electric vehicles

2019

Experimental microwave complex conductivity extraction of vertically aligned MWCNT bundles for microwave subwavelength antenna design

RF properties of carbon nanotube / Copper composite through silicon via based CPW structure for 3D integrated circuits

Covalent anchoring of carbon nanotube-based thermal interface materials using epoxy-silane monolayers

2019

Reliability investigation of a carbon nanotube array thermal interface material

A portable micro glucose sensor based on copper-based nanocomposite structure

2019

Thermal Characterization of Low-Dimensional Materials by Resistance Thermometers

Compact and low loss electrochemical capacitors using a graphite / carbon nanotube hybrid material for miniaturized systems

Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds

Thermal Reliability Study of Polymer Bonded Carbon Nanotube Array Thermal Interface Materials

Egg albumen templated graphene foams for high-performance supercapacitor electrodes and electrochemical sensors

2018

Understanding noninvasive charge transfer doping of graphene: a comparative study

Synthesis Methods of Two-Dimensional MoS2: A Brief Review

An overview of carbon nanotubes based interconnects for microelectronic packaging

A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier

Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications

Graphene-CNT hybrid material as potential thermal solution in electronics applications

Chemical vapor deposition grown graphene on Cu-Pt alloys

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS

The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging

Carbon nanotube growth on different underlayers for thermal interface material application

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Heat dissipation of a hybrid CNT/Graphene based heat spreader

Graphene oxide based coatings on Nitinol for biomedical implant applications: Effectively promote mammalian cell growth but kill bacteria

9. Carbon nanotube growth on different substrates for thermal interface material application

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders

Thermal conductivity measurement of densified carbon nanotube bundles by pulsed photothermal reflectance technique

Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications

Application of two-dimensional layered hexagonal boron nitride in chip cooling

Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes

Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review

Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging

Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging

Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing

Graphene-based heater

Graphene Fibres: Towards high mechanical, thermal and electrical properties state of art

2016

Functionalization mediates heat transport in graphene nanoflakes

Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor

Cooling hot spots by hexagonal boron nitride heat spreaders

Flexible Multifunctionalized Carbon Nanotubes-Based Hybrid Nanowires

Reliability of Graphene-based Films Used for High Power Electronics Packaging

Liquid Phase Exfoliated Graphene for Thermal Management in Electronic Packaging

Chemically enhanced carbon nanotubes based Thermal Interface Materials

Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging

Vertically stacked carbon nanotube-based interconnects for through silicon via application

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Reliability of carbon nanotube bumps for chip on glass application

Use of graphene-based films for hot spot cooling

Study on the verification of IR and RTD methods applied in the thermal measurement of high power chips

Enhanced Heat Spreader Based on Few-Layer Graphene Intercalated With Silane-Functionalization Molecules

1. Thermal Characterization of Power Devices Using Graphene-based Film

Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats

Carbon nanotube/solder hybrid structure for interconnect applications

CHEMICALLY VAPOR DEPOSITED CARBON NANOTUBES FOR VERTICAL ELECTRONICS INTERCONNECT IN PACKAGING APPLICATIONS

Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration

Characterization for Graphene as Heat Spreader Using Thermal Imaging Method

Experimental study of Electrical properties and stability of CNT bumps in high density interconnects

Controlling the Density of CNTs by Different UnderlayerMaterials in PECVD Growth

Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD

Reliability of Carbon Nanotube Bumps for Chip on Film Application

Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology

Graphene Heat Spreader for Thermal Management of Hot Spots

Carbon Nanotubes for Electronic Packaging: Growth, Novel Devices and 3D Networks

Thick film patterning by lift-off process using double-coated single photoresists

Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate

2012

Detecting single molecules inside a carbon nanotube to control molecular sequences using inertia trapping phenomenon

Selective growth of double-walled carbon nanotubes on gold films

2012

Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene

Graphene Heat Spreader for Thermal Management of Hot Spots in Electronic Packaging

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers

Use of carbon nanotubes in potential electronics packaging applications

3D computational fluid dynamics simulation of carbon nanotube based microchannel on-chip cooler

Future Emerging Packaging Technology Using Carbon Nanotubes

Application of through silicon via technology for in situ temperature monitoring on thermal interfaces

Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly

A Study of the Heat Transfer Characteristics of the Micro-channel Heat Sink

Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg

Carbon Nanotubes as Cooling Fins in Microelectronic Systems

Development of a test platform for thermal characterization using through-silicon-via technology

Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging

A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers

Preparation of Polymer-metal Nanocomposite Films and Performance Evaluation as Thermal Interface Material

A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers

Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant

Nanostructured Polymer-metal Composite for Thermal Interface Material Applications

Estimation of Moisture Variations on Paper Machines