Visar 90 publikationer
2020
Peng Sun, Meijia Qiu, Junlong Huang et al
Chemical Engineering Journal. Vol. 380
Artikel i vetenskaplig tidskrift
Charlotte Tripon-Canseliet, S. Xavier, Yifeng Fu et al
Micromachines. Vol. 10 (9)
Artikel i vetenskaplig tidskrift
Andreas Nylander, Josef Hansson, Majid Kabiri Samani et al
Energies. Vol. 12 (11)
Artikel i vetenskaplig tidskrift
2019
Huang Chen, Guokang Fan, Jie Zhao et al
New Journal of Chemistry. Vol. 43 (20), p. 7806-7813
Artikel i vetenskaplig tidskrift
Yifeng Fu, G Cui, Kjell Jeppson
Materials. Vol. 12 (11)
Reviewartikel
2019
Qi Li, S. Sun, Anderson David Smith et al
Journal of Power Sources, p. 374-383
Artikel i vetenskaplig tidskrift
2018
Majid Kabiri Samani, Shuangxi Sun, Yifeng Fu et al
Advanced Materials Interfaces. Vol. 2018 (5)
Artikel i vetenskaplig tidskrift
2018
Andreas Nylander, Christian Chandra Darmawan, Ana Borta Boyon et al
2018 24TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC)
Paper i proceeding
2018
Ya Liu, Xiaoli Zhao, Cancan Wang et al
Journal of Materials Chemistry A. Vol. 6 (37), p. 18267-18275
Artikel i vetenskaplig tidskrift
Ankit Nalin Mehta, Wei Mu, Murali Murugesan et al
Journal of Materials Science: Materials in Electronics. Vol. 29 (7), p. 5239-5252
Artikel i vetenskaplig tidskrift
2017
Jie Sun, X. J. Li, W. L. Guo et al
Crystals. Vol. 7 (7), p. Article no 198 -
Artikel i vetenskaplig tidskrift
2017
S. Chen, B. Shan, Y. Yang et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 113-119
Paper i proceeding
2017
Di Jiang, Shuangxi Sun, Michael Edwards et al
Flexible and Printed Electronics. Vol. 2 (2)
Artikel i vetenskaplig tidskrift
2017
S. Huang, W. Ke, Y. Yang et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 143-146
Paper i proceeding
2017
ANDREAS NYLANDER, Yifeng Fu, L. Ye et al
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 175-181
Paper i proceeding
2017
C. C. Darmawan, L. Ye, Majid Kabiri Samani et al
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 190-193
Paper i proceeding
2017
Yong Zhang, Yifeng Fu, Michael Edwards et al
Materials Letters. Vol. 193, p. 255-258
Artikel i vetenskaplig tidskrift
2016
Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability. Vol. 56, p. 129-135
Artikel i vetenskaplig tidskrift
2016
Wei Mu, Yifeng Fu, Shuangxi Sun et al
Chemical Engineering Journal. Vol. 304 (15 November 2016), p. 106-114
Artikel i vetenskaplig tidskrift
2016
Yong Zhang, S. Huang, Nan Wang et al
China Semiconductor Technology International Conference (CSTIC) (Shanghai, March 13-14)
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2016
Shirong Huang, Jie Bao, N. Wang et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p. Art no 7583272; Pages 889-892
Paper i proceeding
2016
Yifeng Fu, Shuangxi Sun, Wei Mu et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2016
Shuangxi Sun, Wei Mu, Michael Edwards et al
Nanotechnology. Vol. 27 (33), p. Art no335705-
Artikel i vetenskaplig tidskrift
2016
Shuangxi Sun, Peng Su, Nan Wang et al
IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016
Paper i proceeding
2016
Changhong Zhao, Santosh Pandit, Yifeng Fu et al
RSC Advances. Vol. 6 (44), p. 38124-38134
Artikel i vetenskaplig tidskrift
2016
Yifeng Fu
Shuangxi Sun
Paper i proceeding
2016
Di Jiang, Nan Wang, Michael Edwards et al
Small. Vol. 12 (11), p. 1521-1526
Artikel i vetenskaplig tidskrift
2016
Kjell Jeppson, Jie Bao, S. Huang et al
29th IEEE International Conference on Microelectronic Test Structures (ICMTS), Yokohama, Japan, Mar 28-31, 2016, p. 32-36
Paper i proceeding
2016
Majid Kabiri Samani, Shuangxi Sun, Yifeng Fu et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2016
Yong Zhang, Michael Edwards, Kabir Majid Samani et al
Carbon. Vol. 106, p. 195-201
Artikel i vetenskaplig tidskrift
2016
Jie Bao, Y. Zhang, S. Huang et al
Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering. Vol. 24 (1), p. 210-217
Artikel i övriga tidskrifter
2016
Wei Mu, Eun-Hye Kwak, Bingan Chen et al
Electronic Materials Letters. Vol. 12 (3), p. 329-337
Artikel i vetenskaplig tidskrift
2016
Wei Mu, Josef Hansson, Shuangxi Sun et al
66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, USA, May 31-Jun 03, 2016, p. 211-216
Paper i proceeding
2016
Yifeng Fu, Wei Mu, Shuangxi Sun et al
2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764713-
Paper i proceeding
2016
Shirong Huang, N. Wang, Jie Bao et al
6th Electronic System-integration Technology Conference (ESTC 2016), p. Article no 7764696-
Paper i proceeding
2016
Jie Bao, Michael Edwards, Shirong Huang et al
Journal of Physics D: Applied Physics. Vol. 49 (July 2016), p. 265501-
Artikel i vetenskaplig tidskrift
2016
Jie Bao, Kjell Jeppson, Michael Edwards et al
Electronic Materials Letters. Vol. 12 (1), p. 1-16
Artikel i vetenskaplig tidskrift
2016
Yong Zhang, Michael Edwards, Yifeng Fu et al
IMAPS Nordic Annual Conference 2016; Tonsberg; Norway; 5-7 June 2016
Paper i proceeding
2016
Abdelhafid Zehri, Josef Hansson, Lilei Ye et al
IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016
Paper i proceeding
H. X. Han, Yong Zhang, Nan Wang et al
Nature Communications. Vol. 7
Artikel i vetenskaplig tidskrift
2016
Wei Mu, Yifeng Fu, Shuangxi Sun et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2015
Shuangxi Sun, Jie Bao, Wei Mu et al
2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015, San Diego, United States, 26-29 May 2015, p. 1658-1663
Paper i proceeding
2015
Nan Wang, Di Jiang, L. Ye et al
Advanced Functional Materials. Vol. 25 (26), p. 4135-4143
Artikel i vetenskaplig tidskrift
2015
Shirong Huang, Yong Zhang, Nan Wang et al
16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11-14 August 2015, p. 852-855
Paper i proceeding
2015
Yong Zhang, Yifeng Fu, Ye Lilei et al
Graphene Week in Manchester
Paper i proceeding
2015
J. Daon, Shuangxi Sun, Di Jiang et al
2015 21st International Workshop on Thermal Investigations of Ics and Systems (Therminic)
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2015
Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability
Artikel i vetenskaplig tidskrift
2015
Di Jiang, Wei Mu, Si Chen et al
IEEE Electron Device Letters. Vol. 36 (5), p. 499-501
Artikel i vetenskaplig tidskrift
2015
Wei Mu, Shuangxi Sun, Di Jiang et al
Journal of Electronic Materials. Vol. 2015 (17 April), p. http://dx.doi.org/10.1007/s11664-015-3752-2-
Artikel i vetenskaplig tidskrift
2014
X. Fan, X. Li, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962753-
Paper i proceeding
2014
Yong Zhang, Pengtu Zhang, Nan Wang et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962834-
Paper i proceeding
2014
Yan Zhang, C. He, Yong Zhang et al
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014, p. 1507-1511
Paper i proceeding
2014
Hao xue han, Y. A. Kosevich, Yong Zhang et al
IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014, p. 1-4
Paper i proceeding
2014
Johan Liu, Pengtu Zhang, Nan Wang et al
2014 Electronic Components & Technology Conference, p. 459 - 463
Paper i proceeding
2014
J. Daon, Shuangxi Sun, Di Jiang et al
IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014
Paper i proceeding
2014
Di Jiang, Shuangxi Sun, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962751-
Paper i proceeding
2014
Johan Liu, Yifeng Fu, Di Jiang
Proceedings of the 12th international conference on Solid States and Integrated Circuits, ICSICT2014, p. 47-50
Paper i proceeding
2013
Johan Liu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (1), p. 13-27
Artikel i vetenskaplig tidskrift
2013
Shirong Huang, Yong Zhang, Shuangxi Sun et al
Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT), p. 403-408
Paper i proceeding
2013
Yan Zhang, Yingjie Zhou, Jingyu Fan et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 1085-1088
Paper i proceeding
2013
Liang Xu, Di Jiang, Yifeng Fu et al
Proceedings of the 19th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems, September 25-27 2013, Berlin, Germany, IEEE / Therminic 2013, p. 248-252
Paper i proceeding
2013
Liang Xu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (3), p. 236-240
Artikel i vetenskaplig tidskrift
2013
X. Li, Wei Mu, Di Jiang et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 845-848
Paper i proceeding
2013
Shirong Huang, Yong Zhang, Shuangxi Sun et al
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), p. 347-352
Paper i proceeding
2013
Zhaoli Gao, Yong Zhang, Yifeng Fu et al
Proceedings of the IEEE 2013 Electronic Components & Technology Conference, p. 2075-2078
Paper i proceeding
2012
Yifeng Fu
Doktorsavhandling
2012
Yifeng Fu, L. Ye, Johan Liu
Materials Letters. Vol. 76, p. 117-119
Artikel i vetenskaplig tidskrift
2012
Di Jiang, Yifeng Fu, Yan Zhang et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, Budapest, 25-27 September 2012, p. 213-216
Paper i proceeding
Zhili Hu, Gustaf Mårtensson, Murali Murugesan et al
Applied Physics Letters. Vol. 101 (13), p. Art. no. 133105-
Artikel i vetenskaplig tidskrift
2012
Yifeng Fu, Si Chen, Johan Bielecki et al
Materials Letters. Vol. 72, p. 78-80
Artikel i vetenskaplig tidskrift
Yifeng Fu, Björn Carlberg, Niklas Lindahl et al
Advanced Materials. Vol. 24 (12), p. 1576-1581
Artikel i vetenskaplig tidskrift
2012
Zhaoli Gao, Yong Zhang, Yifeng Fu et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, p. 217-220
Paper i proceeding
2012
Yifeng Fu, N. Nabiollahi, Teng Wang et al
Nanotechnology. Vol. 23 (4)
Artikel i vetenskaplig tidskrift
2011
D. Wang, J. He, X. Wang et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 560-563
Paper i proceeding
2010
Johan Liu, Teng Wang, Yifeng Fu et al
2010 10th IEEE Conference on Nanotechnology, NANO 2010, p. 160-166
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2010
N. Nabiollahi, Yifeng Fu, Johan Liu
IMAPS Nordic Annual Conference 2010, Proceedings, p. 44-47
Paper i proceeding
2010
Johan Liu, Yiheng Qin, Carl Zandén et al
ELTE 2010 & 34th IMAPS-CPMT
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2010
Yifeng Fu, Teng Wang, Ove Jonsson et al
Journal of Micromechanics and Microengineering. Vol. 20 (2), p. id 025027 (5 pp)-
Artikel i vetenskaplig tidskrift
2010
Yifeng Fu, Yiheng Qin, Teng Wang et al
Advanced Materials. Vol. 22 (44), p. 5039-5042
Artikel i vetenskaplig tidskrift
2009
Shun Wang, Yan Zhang, Yifeng Fu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 255-259
Paper i proceeding
2009
Yifeng Fu, Teng Wang, Johan Liu
Proceedings of the Annual Nordic Conference, p. 35-38
Paper i proceeding
2009
Yifeng Fu, Teng Wang, Johan Liu et al
Proceedings of the 9th Nanotechnology Conference, p. 10-14
Paper i proceeding
2009
Yifeng Fu, Teng Wang, Johan Liu
IMAPS Nordic Annual Conference 2009; Tonsberg; Norway; 13 September 2009 through 15 September 2009, p. 35-38
Paper i proceeding
2008
Johan Liu, Yifeng Fu, Teng Wang
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. E3-01
Paper i proceeding
2008
Yi Fan, Yifeng Fu, Yan Zhang et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. D1-05
Paper i proceeding
2008
Björn Carlberg, Teng Wang, Yifeng Fu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1395-1400
Paper i proceeding
2008
Yi Fan, Yifeng Fu, Yan Zhang et al
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008
Paper i proceeding
2008
Yi Fan, Yifeng Fu, Teng Wang et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1391-1394
Paper i proceeding
2008
Björn Carlberg, Teng Wang, Yifeng Fu et al
proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC), p. 191-197
Paper i proceeding
1993
Guy Dumont, I. Jonsson, M. Davies et al
IEEE Transacrtions on Control Systems Technology. Vol. 1 (2)
Artikel i vetenskaplig tidskrift