Yifeng Fu
Forskarassistent vid
Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system
Visar 84 publikationer
2018
Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds
Majid Kabiri Samani, Shuangxi Sun, Yifeng Fu et al
Advanced Materials Interfaces. Vol. 2018 (5)
Artikel i vetenskaplig tidskrift
2018
Egg albumen templated graphene foams for high-performance supercapacitor electrodes and electrochemical sensors
Ya Liu, Xiaoli Zhao, Cancan Wang et al
Journal of Materials Chemistry A. Vol. 6 (37), p. 18267-18275
Artikel i vetenskaplig tidskrift
2018
Understanding noninvasive charge transfer doping of graphene: a comparative study
Ankit Nalin Mehta, Wei Mu, Murali Murugesan et al
Journal of Materials Science: Materials in Electronics. Vol. 29 (7), p. 5239-5252
Artikel i vetenskaplig tidskrift
2017
Synthesis Methods of Two-Dimensional MoS2: A Brief Review
Jie Sun, X. J. Li, W. L. Guo et al
Crystals. Vol. 7 (7), p. Article no 198 -
Artikel i vetenskaplig tidskrift
2017
An overview of carbon nanotubes based interconnects for microelectronic packaging
S. Chen, B. Shan, Y. Yang et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 113-119
Paper i proceeding
2017
A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds
Di Jiang, Shuangxi Sun, Michael Edwards et al
Flexible and Printed Electronics. Vol. 2 (2)
Artikel i vetenskaplig tidskrift
2017
Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier
S. Huang, W. Ke, Y. Yang et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 143-146
Paper i proceeding
2017
Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications
ANDREAS NYLANDER, Yifeng Fu, L. Ye et al
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 175-181
Paper i proceeding
2017
Graphene-CNT hybrid material as potential thermal solution in electronics applications
C. C. Darmawan, L. Ye, Majid Kabiri Samani et al
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 190-193
Paper i proceeding
2017
Chemical vapor deposition grown graphene on Cu-Pt alloys
Yong Zhang, Yifeng Fu, Michael Edwards et al
Materials Letters. Vol. 193, p. 255-258
Artikel i vetenskaplig tidskrift
2016
Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging
Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability. Vol. 56, p. 129-135
Artikel i vetenskaplig tidskrift
2016
2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS
Yong Zhang, S. Huang, Nan Wang et al
China Semiconductor Technology International Conference (CSTIC) (Shanghai, March 13-14)
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2016
Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor
Wei Mu, Yifeng Fu, Shuangxi Sun et al
Chemical Engineering Journal. Vol. 304 (15 November 2016), p. 106-114
Artikel i vetenskaplig tidskrift
2016
The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging
Shirong Huang, Jie Bao, N. Wang et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p. Art no 7583272; Pages 889-892
Paper i proceeding
2016
Carbon nanotube growth on different underlayers for thermal interface material application
Yifeng Fu, Shuangxi Sun, Wei Mu et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2016
Heat dissipation of a hybrid CNT/Graphene based heat spreader
Shuangxi Sun, Peng Su, Nan Wang et al
IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016
Paper i proceeding
2016
Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects
Shuangxi Sun, Wei Mu, Michael Edwards et al
Nanotechnology. Vol. 27 (33), p. Art no335705-
Artikel i vetenskaplig tidskrift
2016
Graphene oxide based coatings on Nitinol for biomedical implant applications: Effectively promote mammalian cell growth but kill bacteria
Changhong Zhao, Santosh Pandit, Yifeng Fu et al
RSC Advances. Vol. 6 (44), p. 38124-38134
Artikel i vetenskaplig tidskrift
2016
9. Carbon nanotube growth on different substrates for thermal interface material application
Yifeng Fu
Shuangxi Sun
Paper i proceeding
2016
Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders
Kjell Jeppson, Jie Bao, S. Huang et al
29th IEEE International Conference on Microelectronic Test Structures (ICMTS), Yokohama, Japan, Mar 28-31, 2016, p. 32-36
Paper i proceeding
2016
Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors
Di Jiang, Nan Wang, Michael Edwards et al
Small. Vol. 12 (11), p. 1521-1526
Artikel i vetenskaplig tidskrift
2016
Thermal conductivity measurement of densified carbon nanotube bundles by pulsed photothermal reflectance technique
Majid Kabiri Samani, Shuangxi Sun, Yifeng Fu et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2016
Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications
Yong Zhang, Michael Edwards, Kabir Majid Samani et al
Carbon. Vol. 106, p. 195-201
Artikel i vetenskaplig tidskrift
2016
Application of two-dimensional layered hexagonal boron nitride in chip cooling
Jie Bao, Y. Zhang, S. Huang et al
Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering. Vol. 24 (1), p. 210-217
Artikel i övriga tidskrifter
2016
Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes
Wei Mu, Eun-Hye Kwak, Bingan Chen et al
Electronic Materials Letters. Vol. 12 (3), p. 329-337
Artikel i vetenskaplig tidskrift
2016
Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects
Wei Mu, Josef Hansson, Shuangxi Sun et al
66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, USA, May 31-Jun 03, 2016, p. 211-216
Paper i proceeding
2016
Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review
Yifeng Fu, Wei Mu, Shuangxi Sun et al
2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764713-
Paper i proceeding
2016
Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging
Shirong Huang, N. Wang, Jie Bao et al
6th Electronic System-integration Technology Conference (ESTC 2016), p. Article no 7764696-
Paper i proceeding
2016
Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging
Jie Bao, Michael Edwards, Shirong Huang et al
Journal of Physics D: Applied Physics. Vol. 49 (July 2016), p. 265501-
Artikel i vetenskaplig tidskrift
2016
Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing
Jie Bao, Kjell Jeppson, Michael Edwards et al
Electronic Materials Letters. Vol. 12 (1), p. 1-16
Artikel i vetenskaplig tidskrift
2016
Graphene-based heater
Yong Zhang, Michael Edwards, Yifeng Fu et al
IMAPS Nordic Annual Conference 2016; Tonsberg; Norway; 5-7 June 2016
Paper i proceeding
2016
Graphene Fibres: Towards high mechanical, thermal and electrical properties state of art
Abdelhafid Zehri, Josef Hansson, Lilei Ye et al
IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016
Paper i proceeding
2016
Functionalization mediates heat transport in graphene nanoflakes
H. X. Han, Yong Zhang, Nan Wang et al
Nature Communications. Vol. 7
Artikel i vetenskaplig tidskrift
2016
Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor
Wei Mu, Yifeng Fu, Shuangxi Sun et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2015
Cooling hot spots by hexagonal boron nitride heat spreaders
Shuangxi Sun, Jie Bao, Wei Mu et al
2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015, San Diego, United States, 26-29 May 2015, p. 1658-1663
Paper i proceeding
2015
Flexible Multifunctionalized Carbon Nanotubes-Based Hybrid Nanowires
Nan Wang, Di Jiang, L. Ye et al
Advanced Functional Materials. Vol. 25 (26), p. 4135-4143
Artikel i vetenskaplig tidskrift
2015
Reliability of Graphene-based Films Used for High Power Electronics Packaging
Shirong Huang, Yong Zhang, Nan Wang et al
16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11-14 August 2015, p. 852-855
Paper i proceeding
2015
Liquid Phase Exfoliated Graphene for Thermal Management in Electronic Packaging
Yong Zhang, Yifeng Fu, Ye Lilei et al
Graphene Week in Manchester
Paper i proceeding
2015
Chemically enhanced carbon nanotubes based Thermal Interface Materials
J. Daon, Shuangxi Sun, Di Jiang et al
2015 21st International Workshop on Thermal Investigations of Ics and Systems (Therminic)
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2015
Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging
Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability
Artikel i vetenskaplig tidskrift
2015
Vertically stacked carbon nanotube-based interconnects for through silicon via application
Di Jiang, Wei Mu, Si Chen et al
IEEE Electron Device Letters. Vol. 36 (5), p. 499-501
Artikel i vetenskaplig tidskrift
2015
Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications
Wei Mu, Shuangxi Sun, Di Jiang et al
Journal of Electronic Materials. Vol. 2015 (17 April), p. http://dx.doi.org/10.1007/s11664-015-3752-2-
Artikel i vetenskaplig tidskrift
2014
Reliability of carbon nanotube bumps for chip on glass application
X. Fan, X. Li, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962753-
Paper i proceeding
2014
Use of graphene-based films for hot spot cooling
Yong Zhang, Pengtu Zhang, Nan Wang et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962834-
Paper i proceeding
2014
Study on the verification of IR and RTD methods applied in the thermal measurement of high power chips
Yan Zhang, C. He, Yong Zhang et al
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014, p. 1507-1511
Paper i proceeding
2014
Enhanced Heat Spreader Based on Few-Layer Graphene Intercalated With Silane-Functionalization Molecules
Hao xue han, Y. A. Kosevich, Yong Zhang et al
IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014, p. 1-4
Paper i proceeding
2014
1. Thermal Characterization of Power Devices Using Graphene-based Film
Johan Liu, Pengtu Zhang, Nan Wang et al
2014 Electronic Components & Technology Conference, p. 459 - 463
Paper i proceeding
2014
Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats
J. Daon, Shuangxi Sun, Di Jiang et al
IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014
Paper i proceeding
2014
Carbon nanotube/solder hybrid structure for interconnect applications
Di Jiang, Shuangxi Sun, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962751-
Paper i proceeding
2014
CHEMICALLY VAPOR DEPOSITED CARBON NANOTUBES FOR VERTICAL ELECTRONICS INTERCONNECT IN PACKAGING APPLICATIONS
Johan Liu, Yifeng Fu, Di Jiang
Proceedings of the 12th international conference on Solid States and Integrated Circuits, ICSICT2014, p. 47-50
Paper i proceeding
2014
Thermal characterization of power devices using graphene-based film
P. Zhang, Nan Wang, Carl Zandén et al
64th Electronic Components and Technology Conference, ECTC 2014; Walt Disney World Swan and Dolphin ResortOrlando; United States; 27 May 2014 through 30 May 2014, p. 459-463
Paper i proceeding
2013
Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration
Johan Liu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (1), p. 13-27
Artikel i vetenskaplig tidskrift
2013
Characterization for Graphene as Heat Spreader Using Thermal Imaging Method
Shirong Huang, Yong Zhang, Shuangxi Sun et al
Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT), p. 403-408
Paper i proceeding
2013
Experimental study of Electrical properties and stability of CNT bumps in high density interconnects
Yan Zhang, Yingjie Zhou, Jingyu Fan et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 1085-1088
Paper i proceeding
2013
Controlling the Density of CNTs by Different UnderlayerMaterials in PECVD Growth
Liang Xu, Di Jiang, Yifeng Fu et al
Proceedings of the 19th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems, September 25-27 2013, Berlin, Germany, IEEE / Therminic 2013, p. 248-252
Paper i proceeding
2013
Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD
Liang Xu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (3), p. 236-240
Artikel i vetenskaplig tidskrift
2013
Reliability of Carbon Nanotube Bumps for Chip on Film Application
X. Li, Wei Mu, Di Jiang et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 845-848
Paper i proceeding
2013
Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology
Shirong Huang, Yong Zhang, Shuangxi Sun et al
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), p. 347-352
Paper i proceeding
2013
Graphene Heat Spreader for Thermal Management of Hot Spots
Zhaoli Gao, Yong Zhang, Yifeng Fu et al
Proceedings of the IEEE 2013 Electronic Components & Technology Conference, p. 2075-2078
Paper i proceeding
2012
Carbon Nanotubes for Electronic Packaging: Growth, Novel Devices and 3D Networks
Yifeng Fu
Doktorsavhandling
2012
Thick film patterning by lift-off process using double-coated single photoresists
Yifeng Fu, L. Ye, Johan Liu
Materials Letters. Vol. 76, p. 117-119
Artikel i vetenskaplig tidskrift
2012
Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate
Di Jiang, Yifeng Fu, Yan Zhang et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, Budapest, 25-27 September 2012, p. 213-216
Paper i proceeding
2012
Detecting single molecules inside a carbon nanotube to control molecular sequences using inertia trapping phenomenon
Zhili Hu, Gustaf Mårtensson, Murali Murugesan et al
Applied Physics Letters. Vol. 101 (13), p. Art. no. 133105-
Artikel i vetenskaplig tidskrift
2012
Selective growth of double-walled carbon nanotubes on gold films
Yifeng Fu, Si Chen, Johan Bielecki et al
Materials Letters. Vol. 72, p. 78-80
Artikel i vetenskaplig tidskrift
2012
Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene
Yifeng Fu, Björn Carlberg, Niklas Lindahl et al
Advanced Materials. Vol. 24 (12), p. 1576-1581
Artikel i vetenskaplig tidskrift
2012
Graphene Heat Spreader for Thermal Management of Hot Spots in Electronic Packaging
Zhaoli Gao, Yong Zhang, Yifeng Fu et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, p. 217-220
Paper i proceeding
2012
A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity
Yifeng Fu, N. Nabiollahi, Teng Wang et al
Nanotechnology. Vol. 23 (4)
Artikel i vetenskaplig tidskrift
2011
Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers
D. Wang, J. He, X. Wang et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 560-563
Paper i proceeding
2010
Use of carbon nanotubes in potential electronics packaging applications
Johan Liu, Teng Wang, Yifeng Fu et al
2010 10th IEEE Conference on Nanotechnology, NANO 2010, p. 160-166
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2010
3D computational fluid dynamics simulation of carbon nanotube based microchannel on-chip cooler
N. Nabiollahi, Yifeng Fu, Johan Liu
IMAPS Nordic Annual Conference 2010, Proceedings, p. 44-47
Paper i proceeding
2010
Future Emerging Packaging Technology Using Carbon Nanotubes
Johan Liu, Yiheng Qin, Carl Zandén et al
ELTE 2010 & 34th IMAPS-CPMT
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2010
Application of through silicon via technology for in situ temperature monitoring on thermal interfaces
Yifeng Fu, Teng Wang, Ove Jonsson et al
Journal of Micromechanics and Microengineering. Vol. 20 (2), p. id 025027 (5 pp)-
Artikel i vetenskaplig tidskrift
2010
Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly
Yifeng Fu, Yiheng Qin, Teng Wang et al
Advanced Materials. Vol. 22 (44), p. 5039-5042
Artikel i vetenskaplig tidskrift
2009
A Study of the Heat Transfer Characteristics of the Micro-channel Heat Sink
Shun Wang, Yan Zhang, Yifeng Fu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 255-259
Paper i proceeding
2009
Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg
Yifeng Fu, Teng Wang, Johan Liu
Proceedings of the Annual Nordic Conference, p. 35-38
Paper i proceeding
2009
Carbon Nanotubes as Cooling Fins in Microelectronic Systems
Yifeng Fu, Teng Wang, Johan Liu et al
Proceedings of the 9th Nanotechnology Conference, p. 10-14
Paper i proceeding
2009
Development of a test platform for thermal characterization using through-silicon-via technology
Yifeng Fu, Teng Wang, Johan Liu
IMAPS Nordic Annual Conference 2009; Tonsberg; Norway; 13 September 2009 through 15 September 2009, p. 35-38
Paper i proceeding
2008
Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging
Johan Liu, Yifeng Fu, Teng Wang
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. E3-01
Paper i proceeding
2008
A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers
Yi Fan, Yifeng Fu, Yan Zhang et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. D1-05
Paper i proceeding
2008
Preparation of Polymer-metal Nanocomposite Films and Performance Evaluation as Thermal Interface Material
Björn Carlberg, Teng Wang, Yifeng Fu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1395-1400
Paper i proceeding
2008
A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers
Yi Fan, Yifeng Fu, Yan Zhang et al
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008
Paper i proceeding
2008
Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant
Yi Fan, Yifeng Fu, Teng Wang et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1391-1394
Paper i proceeding
2008
Nanostructured Polymer-metal Composite for Thermal Interface Material Applications
Björn Carlberg, Teng Wang, Yifeng Fu et al
proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC), p. 191-197
Paper i proceeding
1993
Estimation of Moisture Variations on Paper Machines
Guy Dumont, I. Jonsson, M. Davies et al
IEEE Transacrtions on Control Systems Technology. Vol. 1 (2)
Artikel i vetenskaplig tidskrift
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