Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology
Paper i proceeding, 2013

Monolayer graphene was synthesized through thermal chemical vapor deposition (TCVD) as heat spreader for chip cooling. Platinum (Pt) serpentine functioned as hot spot on the thermal testing chip. The thermal testing chip with monolayer graphene film attached was bonded using flip-chip technology. The temperature at the hot spot with a monolayer graphene film as heat spreader was decreased by about 12°C and had a more uniform temperature compared to those without graphene heat spreader when driven by a heat flux of about 640W/cm 2 . Further improvements to the cooling performance of graphene heat spreader could be made by optimizing the synthesis parameters and transfer process of graphene films. © 2013 IEEE.

Författare

Shirong Huang

Shanghai University, School of Materials Science and Engineering

Yong Zhang

Chalmers, Teknisk fysik, Elektronikmaterial och system

Shuangxi Sun

Chalmers, Teknisk fysik, Elektronikmaterial och system

X. Fan

Shanghai University

Ling Wang

Shanghai University

Yifeng Fu

Chalmers, Teknisk fysik, Elektronikmaterial och system

Yan Zhang

Shanghai University

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial och system

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

347-352

Styrkeområden

Nanovetenskap och nanoteknik

Ämneskategorier

Nanoteknik

DOI

10.1109/EPTC.2013.6745740

ISBN

978-147992833-0

Mer information

Skapat

2017-10-08