Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology
Paper in proceeding, 2013
Author
Shirong Huang
Shanghai University
Yong Zhang
Chalmers, Applied Physics, Electronics Material and Systems
Shuangxi Sun
Chalmers, Applied Physics, Electronics Material and Systems
X. Fan
Shanghai University
Ling Wang
Shanghai University
Yifeng Fu
Chalmers, Applied Physics, Electronics Material and Systems
Yan Zhang
Shanghai University
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Published in
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)
p. 347-352
978-147992833-0 (ISBN)
Categorizing
Areas of Advance
Nanoscience and Nanotechnology
Subject Categories (SSIF 2011)
Nano Technology
Identifiers
DOI
10.1109/EPTC.2013.6745740
ISBN
978-147992833-0