Yong Zhang

Doktorand at Electronics Material and Systems
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Showing 38 publications

2022

Improved Thermal Properties of Three-Dimensional Graphene Network Filled Polymer Composites

Yong Zhang, Fei Yang, Chen Yu et al
Journal of Electronic Materials. Vol. 51 (1), p. 420-425
Journal article
2022

Transparent heaters based on CVD grown few-layer graphene

Yong Zhang, Fei Yang, Hao Liu et al
Journal of Materials Science: Materials in Electronics. Vol. 33 (7), p. 3586-3594
Journal article
2022

High-Performance Electrothermal Film Based on Laser-Induced Graphene

Fei Yang, Chen Yu, Li Zhang et al
Advanced Engineering Materials. Vol. 24 (11)
Journal article
2021

Fabrication and Characterization of Graphene/polyimide Composite Film

Xinjian Gong, Jin Chen, Yong Zhang et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2021

Characterization of Longitudinal Thermal Conductivity of Graphene Film

Jiajia Chen, Xinjian Gong, Sihua Guo et al
2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
Paper in proceeding
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2021
Open Access icon

Graphene-based films: Fabrication, interfacial modification, and applications

Sihua Guo, Jin Chen, Yong Zhang et al
Nanomaterials. Vol. 11 (10)
Review article
2021

Thermal Conduction of Fiber-Reinforced Polymer under Loading

Pei Lu, Huihui Wang, Yong Zhang et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2021

Thermal Analysis of an Au/Pt/Ti-Based Microheater

Yong Zhang, Chen Yu, Fei Yang et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2021

Thermal Properties of Laser Reduced Graphene Oxide Films

Chen Yu, Fei Yang, Johan Liu et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2021

Thermal Properties of Laser-induced Graphene Films Photothermally Scribed on Bare Polyimide Substrates

Fei Yang, Chen Yu, Johan Liu et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2020
Open Access icon

Properties of Undoped Few-Layer Graphene-Based Transparent Heaters

Yong Zhang, H. Liu, L. Tan et al
Materials. Vol. 13 (1)
Journal article
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2020

Graphene oxide for nonvolatile memory application by using electrophoretic technique

Hao Liu, Jun Li, S. Chen et al
Materials Today Communications. Vol. 25
Journal article
2017

Synthesis and characterization of three-dimensional graphene foams by chemical vapor deposition

Yong Zhang, Kabir Majid Samani, Johan Liu
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 139-142
Paper in proceeding
2017

Chemical vapor deposition grown graphene on Cu-Pt alloys

Yong Zhang, Yifeng Fu, Michael Edwards et al
Materials Letters. Vol. 193, p. 255-258
Journal article
2016

Finite element simulation of 2D-based materials as heat spreaders

Michael Edwards, Yong Zhang, Jie Bao et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceeding
2016
Open Access icon

Functionalization mediates heat transport in graphene nanoflakes

H. X. Han, Yong Zhang, Nan Wang et al
Nature Communications. Vol. 7
Journal article
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2016

2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS

Yong Zhang, S. Huang, Nan Wang et al
China Semiconductor Technology International Conference 2016, CSTIC 2016
Paper in proceeding
2016

Heat dissipation of a hybrid CNT/Graphene based heat spreader

Shuangxi Sun, Peng Su, Nan Wang et al
IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016
Paper in proceeding
2016

Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications

Yong Zhang, Michael Edwards, Kabir Majid Samani et al
Carbon. Vol. 106, p. 195-201
Journal article
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2016

Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging

Jie Bao, Michael Edwards, Shirong Huang et al
Journal of Physics D: Applied Physics. Vol. 49 (July 2016), p. 265501-
Journal article
Show project
2016

Graphene-based heater

Yong Zhang, Michael Edwards, Yifeng Fu et al
IMAPS Nordic Annual Conference 2016; Tonsberg; Norway; 5-7 June 2016
Paper in proceeding
2016

Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders

Kjell Jeppson, Jie Bao, S. Huang et al
29th IEEE International Conference on Microelectronic Test Structures (ICMTS), Yokohama, Japan, Mar 28-31, 2016. Vol. 2016-May, p. 32-36
Paper in proceeding
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2015

Reliability of Graphene-based Films Used for High Power Electronics Packaging

Shirong Huang, Yong Zhang, Nan Wang et al
16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11-14 August 2015, p. 852-855
Paper in proceeding
2015

Liquid Phase Exfoliated Graphene for Thermal Management in Electronic Packaging

Yong Zhang, Yifeng Fu, Ye Lilei et al
Graphene Week in Manchester
Paper in proceeding
2015

Cooling hot spots by hexagonal boron nitride heat spreaders

Shuangxi Sun, Jie Bao, Wei Mu et al
Proceedings - Electronic Components and Technology Conference. Vol. 2015-July, p. 1658-1663
Paper in proceeding
2015

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Wei Mu, Shuangxi Sun, Di Jiang et al
Journal of Electronic Materials. Vol. 44 (8), p. 2898-2907
Journal article
2015

Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application

Yong Zhang, H. X. Han, Nan Wang et al
Advanced Functional Materials. Vol. 25 (28), p. 4430-4435
Journal article
2014

Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications

Xin Luo, Yong Zhang, Carl Zandén et al
Journal of Materials Science: Materials in Electronics. Vol. 25 (5), p. 2333-2338
Journal article
2014

Use of graphene-based films for hot spot cooling

Yong Zhang, Pengtu Zhang, Nan Wang et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962834-
Paper in proceeding
2014

Enhanced Heat Spreader Based on Few-Layer Graphene Intercalated With Silane-Functionalization Molecules

Hao xue han, Y. A. Kosevich, Yong Zhang et al
IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014, p. 1-4
Paper in proceeding
2014

Boron nitride nanofiber and indium composite based thermal interface materials for electronics heat dissipation applications

Xin Luo, Yong Zhang, Carl Zandén et al
Journal of Materials Science: Materials in Electronics. Vol. 25 (5), p. 2333-2338
Journal article
2014

Study on the verification of IR and RTD methods applied in the thermal measurement of high power chips

Yan Zhang, C. He, Yong Zhang et al
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014, p. 1507-1511
Paper in proceeding
2013

Characterization for Graphene as Heat Spreader Using Thermal Imaging Method

Shirong Huang, Yong Zhang, Shuangxi Sun et al
Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT), p. 403-408
Paper in proceeding
2013

Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots

Zhaoli Gao, Yong Zhang, Y. F. Fu et al
Carbon. Vol. 61, p. 342-348
Journal article
2013

Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology

Shirong Huang, Yong Zhang, Shuangxi Sun et al
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), p. 347-352
Paper in proceeding
2013

Graphene Heat Spreader for Thermal Management of Hot Spots

Zhaoli Gao, Yong Zhang, Yifeng Fu et al
Proceedings - Electronic Components and Technology Conference, p. 2075-2078
Paper in proceeding
2012

Graphene Heat Spreader for Thermal Management of Hot Spots in Electronic Packaging

Zhaoli Gao, Yong Zhang, Yifeng Fu et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, p. 217-220
Paper in proceeding

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