Enhanced Heat Spreader Based on Few-Layer Graphene Intercalated With Silane-Functionalization Molecules
Paper in proceedings, 2014

We studied the heat-spreading enhancement of supported few-layer graphene by inserting silane-functionalization molecules between graphene sheets. We calculated the overall thermal resistance of graphene-substrate interface and the in-plane thermal conductivity of graphene sheets by equilibrium molecular dynamics simulations. We probed the spectral phonon transmission coefficient by non-equilibrium Green's function to characterize the local heat conduction through the interface. Our results show that the overal thermal resistance between the substrate graphene and the upper two-layer graphene underwent a three-fold increase by the presence of the molecules, while the local heat conduction from the hot spot to the graphene sheets through the molecules was largely intensified. Furthermore, the in-plane thermal conductivity of the few-layer graphene increased by 60% compared with the supported graphene non-bonded to the substrate through the molecules. This increase is attributed to the refrained cross-plane phonon scattering which in turn reinforces the in-plane heat conduction of the few-layer graphene. In summary, we proved that by inserting silane-functionalization molecules, the few-layer graphene becomes an ideal candidate for heat spreading by guiding heat more efficiently away from the heat source.

Author

Hao xue han

Centre national de la recherche scientifique (CNRS)

Ecole Centrale Paris

Y. A. Kosevich

Russian Academy of Sciences

Centre national de la recherche scientifique (CNRS)

Ecole Centrale Paris

Yong Zhang

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Yifeng Fu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Lilei Ye

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

S. Volz

Centre national de la recherche scientifique (CNRS)

Ecole Centrale Paris

IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014

1-4

Subject Categories

Materials Engineering

DOI

10.1109/THERMINIC.2014.6972537

ISBN

978-147995415-5

More information

Latest update

9/7/2018 1