Cooling hot spots by hexagonal boron nitride heat spreaders
Paper in proceedings, 2015

As the electronic systems become smaller and faster, a thinner and higher-efficiency heat spreader is demanded to meet the thermal dissipation requirement. In this work, we proposed a layered hBN film based heat spreader to dissipate the thermal energy generated by hot spots on high power chips. The liquid phase exfoliation method was employed to synthesize hBN flakes. Different layers of hBN film were characterized using SEM, TEM and Raman spectroscopy. Afterwards, the films were directly attached onto the target power chips. The power chips were integrated with temperature sensor and hot spot in order to analyze the thermal performance of the hBN heat spreader. IR Camera was used to capture the heat spreading effect of the hBN heat spreader and monitor the temperature distribution around the hot spot. The temperature at the hot spot driven by a heat flux of around 600W/cm2 was decreased by about 20% compared to the sample without the BN film. The potential of using hBN heat spreader for cooling hot spots was demonstrated in this work.

Author

Shuangxi Sun

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Jie Bao

Shanghai University

Wei Mu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Yifeng Fu

SHT Smart High-Tech

Yong Zhang

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

L. Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015, San Diego, United States, 26-29 May 2015

0569-5503 (ISSN)

1658-1663

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/ECTC.2015.7159819

ISBN

978-1-4799-8609-5

More information

Latest update

3/7/2018 7