Shuangxi Sun

Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds

Anisotropic thermal conductivity of vertically self-ordered Nanocrystalline Boron Nitride thin films for thermal hotspot mitigation in electronics

A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Evaluating CNT-Based Interconnects : A Nummerical Tool to Characterize Hybrid CNT-Copper Interconnects

Test structures for studying flexible interconnect supported by carbon nanotube scaffolds

2017

Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

Thermal conductivity measurement of densified carbon nanotube bundles by pulsed photothermal reflectance technique

Carbon nanotube growth on different underlayers for thermal interface material application

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Application of two-dimensional layered hexagonal boron nitride in chip cooling

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review

2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS

Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

Heat dissipation of a hybrid CNT/Graphene based heat spreader

Thermal properties of TIM using CNTs forest in electronics packaging

Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders

Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

Cooling hot spots by hexagonal boron nitride heat spreaders

Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Chemically enhanced carbon nanotubes based Thermal Interface Materials

Characterization of Nanoscale Materials for 3D IC Interconnect and Heat Dissipation Applications

Carbon nanotube/solder hybrid structure for interconnect applications

Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats

Characterization for Graphene as Heat Spreader Using Thermal Imaging Method

Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology

Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material