Test structures for studying flexible interconnect supported by carbon nanotube scaffolds
Paper in proceedings, 2017

Due to their flexibility and compatibility with silicon devices, the use of carbon nanotubes as scaffolds for metal interconnect in flexible and wearable electronics has been proposed. This paper examines the performance of dual-height carbon nanotubes as flexible scaffolds for horizontal and vertical interconnects. For this purpose, a number of test structures have been designed and fabricated and their electrical and mechanical performance been investigated.

Author

Kjell Jeppson

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Di Jiang

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Shuangxi Sun

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Michael Edwards

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

International Conference on Microelectronic Test Structures

Vol. 2017

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

Nano Technology

More information

Latest update

9/21/2018