Test structures for studying flexible interconnect supported by carbon nanotube scaffolds
Paper i proceeding, 2017

Due to their flexibility and compatibility with silicon devices, the use of carbon nanotubes as scaffolds for metal interconnect in flexible and wearable electronics has been proposed. This paper examines the performance of dual-height carbon nanotubes as flexible scaffolds for horizontal and vertical interconnects. For this purpose, a number of test structures have been designed and fabricated and their electrical and mechanical performance been investigated.

Författare

Kjell Jeppson

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Di Jiang

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Shuangxi Sun

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Michael Edwards

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

International Conference on Microelectronic Test Structures

Vol. 2017

Ämneskategorier

Elektroteknik och elektronik

Nanoteknik