Di Jiang

A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Test structures for studying flexible interconnect supported by carbon nanotube scaffolds

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Flexible Multi-functionalized Carbon Nanotubes Based Hybrid Nanowires

Flexible Multifunctionalized Carbon Nanotubes-Based Hybrid Nanowires

2015

Carbon Nanotube Based Interconnect Material for Electronic Applications

Vertically stacked carbon nanotube-based interconnects for through silicon via application

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Chemically enhanced carbon nanotubes based Thermal Interface Materials

Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles

A solder joint structure with vertically aligned carbon nanofibres as reinforcements

Carbon nanotube/solder hybrid structure for interconnect applications

CHEMICALLY VAPOR DEPOSITED CARBON NANOTUBES FOR VERTICAL ELECTRONICS INTERCONNECT IN PACKAGING APPLICATIONS

Reliability of carbon nanotube bumps for chip on glass application

Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats

Experimental study of Electrical properties and stability of CNT bumps in high density interconnects

Controlling the Density of CNTs by Different UnderlayerMaterials in PECVD Growth

Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD

Vertically Aligned Carbon Nanotubes for Electrical Interconnect

Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application

Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration

Reliability of Carbon Nanotube Bumps for Chip on Film Application

Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler

Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate

Formation of three-dimensional carbon nanotube structures by controllable vapor densification

Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

Electrical Interconnects Made of Carbon Nanotubes: Applications in 3D Chip Stacking