Reliability of carbon nanotube bumps for chip on glass application
Paper i proceeding, 2014

Carbon nanotubes (CNTs) are an ideal candidate material for electronic interconnects due to their extraordinary thermal, electrical and mechanical properties. In this study, densified CNT bumps utilizing the paper-mediated controlled method were applied as the interconnection for chip on glass (COG) applications, and the silicon chip with patterned CNT bumps was then flipped and bonded onto a glass substrate using anisotropic conductive adhesive (ACA) at a bonding pressure of 127.4 Mpa, 170°C for 8 seconds. The electrical properties of the COG were evaluated with the contact resistance of each bump measured using the four-point probe method. Three different structure traces, marked as Trace A, Trace B, and Trace C, were tested, respectively. Thermal cycling (-40 to 85°C, 800 cycles) and damp heat tests (85°C/85% RH, 1000 hours) were also conducted to evaluate the reliability of the CNT-COG structure. The average contact resistance of the samples was recorded during these tests, in which there was no obvious electrical failure observed after both the thermal cycling and damp heat tests. The results of these tests indicated that the COG has good reliability and the CNT bumps have promising potential applications in COG.

Författare

X. Fan

Shanghai University

X. Li

Shanghai University

Wei Mu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Di Jiang

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

S. Huang

Shanghai University

Yifeng Fu

SHT Smart High-Tech

Y. Zhang

Shanghai University

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014

Art. no. 6962753-

Ämneskategorier

Nanoteknik

DOI

10.1109/ESTC.2014.6962753

ISBN

978-147994026-4