Wei Mu

2018

Understanding noninvasive charge transfer doping of graphene: a comparative study

Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

Carbon nanotube growth on different underlayers for thermal interface material application

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation

Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes

Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives

Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review

Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

3D Integration of Carbon Based Electronics

Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor

Cooling hot spots by hexagonal boron nitride heat spreaders

Unusual tensile behavior of fiber-reinforced indium matrix composite and its in-situ TEM straining observation

Towards 3D Integration of Carbon Based Electronics

Vertically stacked carbon nanotube-based interconnects for through silicon via application

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Reliability of carbon nanotube bumps for chip on glass application

Carbon nanotube/solder hybrid structure for interconnect applications

Reliability of Carbon Nanotube Bumps for Chip on Film Application

Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material