Wei Mu
Doktorand vid
Elektronikmaterial och system
Visar 21 publikationer
2018
Understanding noninvasive charge transfer doping of graphene: a comparative study
Ankit Nalin Mehta, Wei Mu, Murali Murugesan et al
Journal of Materials Science: Materials in Electronics. Vol. 29 (7), p. 5239-5252
Artikel i vetenskaplig tidskrift
2016
Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor
Wei Mu, Yifeng Fu, Shuangxi Sun et al
Chemical Engineering Journal. Vol. 304 (15 November 2016), p. 106-114
Artikel i vetenskaplig tidskrift
2016
Carbon nanotube growth on different underlayers for thermal interface material application
Yifeng Fu, Shuangxi Sun, Wei Mu et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2016
Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects
Shuangxi Sun, Wei Mu, Michael Edwards et al
Nanotechnology. Vol. 27 (33), p. Art no335705-
Artikel i vetenskaplig tidskrift
2016
Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors
Di Jiang, Nan Wang, Michael Edwards et al
Small. Vol. 12 (11), p. 1521-1526
Artikel i vetenskaplig tidskrift
2016
Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation
Xin Luo, J. C. Peng, Carl Zandén et al
Acta Materialia. Vol. 104, p. 109-118
Artikel i vetenskaplig tidskrift
2016
Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes
Wei Mu, Eun-Hye Kwak, Bingan Chen et al
Electronic Materials Letters. Vol. 12 (3), p. 329-337
Artikel i vetenskaplig tidskrift
2016
Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives
Nan Wang, Nikolaos Logothetis, Wei Mu et al
2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764682-
Paper i proceeding
2016
Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects
Wei Mu, Josef Hansson, Shuangxi Sun et al
66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, USA, May 31-Jun 03, 2016, p. 211-216
Paper i proceeding
2016
Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review
Yifeng Fu, Wei Mu, Shuangxi Sun et al
2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764713-
Paper i proceeding
2016
Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor
Wei Mu, Yifeng Fu, Shuangxi Sun et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2015
Cooling hot spots by hexagonal boron nitride heat spreaders
Shuangxi Sun, Jie Bao, Wei Mu et al
2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015, San Diego, United States, 26-29 May 2015, p. 1658-1663
Paper i proceeding
2015
Unusual tensile behavior of fiber-reinforced indium matrix composite and its in-situ TEM straining observation
Xin Luo, Jianchao Peng, Carl Zandén et al
Acta Materialia
Artikel i vetenskaplig tidskrift
2015
Vertically stacked carbon nanotube-based interconnects for through silicon via application
Di Jiang, Wei Mu, Si Chen et al
IEEE Electron Device Letters. Vol. 36 (5), p. 499-501
Artikel i vetenskaplig tidskrift
2015
Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications
Wei Mu, Shuangxi Sun, Di Jiang et al
Journal of Electronic Materials. Vol. 2015 (17 April), p. http://dx.doi.org/10.1007/s11664-015-3752-2-
Artikel i vetenskaplig tidskrift
2014
Reliability of carbon nanotube bumps for chip on glass application
X. Fan, X. Li, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962753-
Paper i proceeding
2014
Carbon nanotube/solder hybrid structure for interconnect applications
Di Jiang, Shuangxi Sun, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962751-
Paper i proceeding
2013
Reliability of Carbon Nanotube Bumps for Chip on Film Application
X. Li, Wei Mu, Di Jiang et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 845-848
Paper i proceeding
2012
Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material
Shuangxi Sun, Wei Mu, Yan Zhang et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging (Article number 6474593), p. 171-176
Paper i proceeding
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