Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives
Paper i proceeding, 2016

In this paper, a graphene enhanced thermal conductive adhesive (G-TCA) was developed for thermal management of power devices. The developed G-TCA has many advantages, including high thermal conductivity, lower density, good dispensing ability. and cost effective. To fabricate G-TCAs. few-layer graphene was utilized as fillers to improve the thermal conductivity of the TCA. The graphene nanosheets were fabricated through a high-speed shear mixing process in a mixed solvent. Compared to many reported liquid exfoliation process, the graphene fabrication process shows many advantages, such as high process efficiency, mass production, low-cost, clean and safe process. G-TCA sample with a hybrid filler ratio of 73% Ag and 3% graphene shows the highest thermal conductivity of 8 W/m K, which is almost four times higher than reference TCAs. A Joule heating setup was built to simulate G-TCA's function in a real electronic component and demonstrate the superior heat dissipation properties of the G-TCAs. Viscosities of the G-TCA samples were regulated in an acceptable range of many dispensing processes to be able to make uniform and fine patterns. Therefore, the developed G-TCA could be widely used for thermal management of power devices and electronic packaging area to decrease their working temperatures and extend the lifetime of devices.


Nan Wang

Elektronikmaterial och system

Nikolaos Logothetis

Elektronikmaterial och system

Wei Mu

Elektronikmaterial och system

S. Huang

Shanghai University

L. Ye

SHT Smart High-Tech

Johan Liu

Elektronikmaterial och system

2016 6th Electronic System-Integration Technology Conference (Estc)

Article no 7764682-


Nanovetenskap och nanoteknik


Annan materialteknik