Nan Wang

Visar 29 publikationer

2018

Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering

Nan Wang, Majid Kabiri Samani, Hu Li et al
Small. Vol. 14 (29)
Artikel i vetenskaplig tidskrift
2017

Sintering of SiC enhanced copper paste for high power applications

Martí Gutierrez, Nan Wang, Majid Kabiri Samani et al
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 151-156
Paper i proceeding
2017

Effect of sintering method on properties of nanosilver paste

Q. Zhang, Johan Liu, W. Ke et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 186-189
Paper i proceeding
2017

Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging

Y. Yang, H. Ye, W. Ke et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 125-128
Paper i proceeding
2017

A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Di Jiang, Shuangxi Sun, Michael Edwards et al
Flexible and Printed Electronics. Vol. 2 (2)
Artikel i vetenskaplig tidskrift
2017

Fabrication and characterization of graphene based film

Yuqing Shi, L. Ye, Abdelhafid Zehri et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 162-166
Paper i proceeding
2017

Cellulose-derived carbon nanofibers/graphene composite electrodes for powerful compact supercapacitors

Volodymyr Kuzmenko, Nan Wang, Mohammad Mazharul Haque et al
RSC Advances. Vol. 7 (73), p. 45968-45977
Artikel i vetenskaplig tidskrift
2017

Efficient surface modification of carbon nanotubes for fabricating high performance CNT based hybrid nanostructures

Nan Wang, Santosh Pandit, L. Ye et al
Carbon. Vol. 111, p. 402-410
Artikel i vetenskaplig tidskrift
2017

Graphene-based heat spreading materials for electronics packaging applications

G. Yuan, B. Shan, S. Chen et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 172-174
Paper i proceeding
2016

2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS

Yong Zhang, S. Huang, Nan Wang et al
China Semiconductor Technology International Conference (CSTIC) (Shanghai, March 13-14)
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2016

Heat dissipation of a hybrid CNT/Graphene based heat spreader

Shuangxi Sun, Peng Su, Nan Wang et al
IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016
Paper i proceeding
2016

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Di Jiang, Nan Wang, Michael Edwards et al
Small. Vol. 12 (11), p. 1521-1526
Artikel i vetenskaplig tidskrift
2016

Synthesis of highly conductive and mechanically strong silver coated silk bundles for flexible electronic applications

Nan Wang, Hafid Zehri, Lilei Ye et al
IMAPS Nordic Annual Conference 2016 Proceedings
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2016

Efficient Surface Modification of Carbon Nanotubes for Fabricating High Performance CNT Based Hybrid Nanostructures

Nan Wang, Santosh Pandit, Lilei Ye et al
Carbon
Artikel i vetenskaplig tidskrift
2016

FREESTANDING CARBON NANOFIBERS/GRAPHENE COMPOSITE ELECTRODES FOR SUPERCAPACITORS

Volodymyr Kuzmenko, Nan Wang, Arun Bhaskar et al
The World Conference on Carbon - Carbon 2016, July 10-15, State College, PA, USA
Paper i proceeding
2016

Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives

Nan Wang, Nikolaos Logothetis, Wei Mu et al
2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764682-
Paper i proceeding
2016

Functionalization mediates heat transport in graphene nanoflakes

H. X. Han, Yong Zhang, Nan Wang et al
Nature Communications. Vol. 7
Artikel i vetenskaplig tidskrift
2015

Flexible Multi-functionalized Carbon Nanotubes Based Hybrid Nanowires

Nan Wang, Di Jiang, Lilei Ye et al
Advanced Functional Materials
Artikel i vetenskaplig tidskrift
2015

Flexible Multifunctionalized Carbon Nanotubes-Based Hybrid Nanowires

Nan Wang, Di Jiang, L. Ye et al
Advanced Functional Materials. Vol. 25 (26), p. 4135-4143
Artikel i vetenskaplig tidskrift
2015

Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application

Yong Zhang, H. X. Han, Nan Wang et al
Advanced Functional Materials. Vol. 25 (28), p. 4430-4435
Artikel i vetenskaplig tidskrift
2015

Reliability of Graphene-based Films Used for High Power Electronics Packaging

Shirong Huang, Yong Zhang, Nan Wang et al
16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11-14 August 2015, p. 852-855
Paper i proceeding
2014

Use of graphene-based films for hot spot cooling

Yong Zhang, Pengtu Zhang, Nan Wang et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962834-
Paper i proceeding
2014

Pre-Study of Graphene-Enhanced Cementitious Materials

Luping Tang, Johan Liu, Nan Wang et al
Rapport
2014

Development and characterization of graphene-enhanced thermal conductive adhesives

Marcello Casa, S. Huang, Paolo Ciambelli et al
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014 (Art. no. 6922700), p. 480-483
Paper i proceeding
2014

1. Thermal Characterization of Power Devices Using Graphene-based Film

Johan Liu, Pengtu Zhang, Nan Wang et al
2014 Electronic Components & Technology Conference, p. 459 - 463
Paper i proceeding
2014

Thermal characterization of power devices using graphene-based film

P. Zhang, Nan Wang, Carl Zandén et al
64th Electronic Components and Technology Conference, ECTC 2014; Walt Disney World Swan and Dolphin ResortOrlando; United States; 27 May 2014 through 30 May 2014, p. 459-463
Paper i proceeding
2012

Reliability investigation of nano-enhanced thermal conductive adhesives

Nan Wang, Murali Murugesan, L. Ye et al
Proceedings of the IEEE Conference on Nanotechnology
Paper i proceeding

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