Reliability investigation of nano-enhanced thermal conductive adhesives
Paper i proceeding, 2012
This paper deals with silver (Ag) coated silicon carbide nanoparticles (SiC@Ag NPs) for thermal conductive interconnect and die attach applications.
Electroless plating
Silver coating
Nanoparticles
Thermal conductive adhesive
Silicon carbide
Thermal conductivity
Författare
Nan Wang
Chalmers, Teknisk fysik, Elektronikmaterial
Murali Murugesan
Chalmers, Teknisk fysik, Elektronikmaterial
L. Ye
SHT Smart High-Tech
Björn Carlberg
Chalmers, Teknisk fysik, Elektronikmaterial
Si Chen
Chalmers, Teknisk fysik, Elektronikmaterial
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
Proceedings of the IEEE Conference on Nanotechnology
19449399 (ISSN) 19449380 (eISSN)
978-146732198-3 (ISBN)
Ämneskategorier
Fysik
DOI
10.1109/NANO.2012.6322137
ISBN
978-146732198-3