Reliability investigation of nano-enhanced thermal conductive adhesives
Paper in proceeding, 2012
This paper deals with silver (Ag) coated silicon carbide nanoparticles (SiC@Ag NPs) for thermal conductive interconnect and die attach applications.
Electroless plating
Silver coating
Nanoparticles
Thermal conductive adhesive
Silicon carbide
Thermal conductivity
Author
Nan Wang
Chalmers, Applied Physics, Electronics Material and Systems
Murali Murugesan
Chalmers, Applied Physics, Electronics Material and Systems
L. Ye
SHT Smart High-Tech
Björn Carlberg
Chalmers, Applied Physics, Electronics Material and Systems
Si Chen
Chalmers, Applied Physics, Electronics Material and Systems
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Proceedings of the IEEE Conference on Nanotechnology
19449399 (ISSN) 19449380 (eISSN)
978-146732198-3 (ISBN)
Subject Categories (SSIF 2011)
Physical Sciences
DOI
10.1109/NANO.2012.6322137
ISBN
978-146732198-3