Reliability investigation of nano-enhanced thermal conductive adhesives
Paper in proceedings, 2012

This paper deals with silver (Ag) coated silicon carbide nanoparticles (SiC@Ag NPs) for thermal conductive interconnect and die attach applications.

Electroless plating

Silver coating

Nanoparticles

Thermal conductive adhesive

Silicon carbide

Thermal conductivity

Author

Nan Wang

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Murali Murugesan

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

L. Ye

SHT Smart High-Tech

Björn Carlberg

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Si Chen

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Proceedings of the IEEE Conference on Nanotechnology

1944-9380 (eISSN)

Subject Categories

Physical Sciences

DOI

10.1109/NANO.2012.6322137

ISBN

978-146732198-3

More information

Latest update

3/7/2018 7