Si Chen

Doktorand at Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Showing 30 publications

2017

Stretchable Thermoelectric Generators Metallized with Liquid Alloy

Seung Hee Jeong, Francisco Javier Cruz, Si Chen et al
ACS Applied Materials & Interfaces. Vol. 9 (18), p. 15791-15797
Journal article
2016

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability. Vol. 56, p. 129-135
Journal article
2016

Mechanical characterization ofnanoparticleenhancedSn-3.0Ag-0.5Cu solder

Lilei Ye, Si Chen, Johan Liu
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceedings
2015

Thermal elastomer composites for soft transducers

Seung Hee Jeong, Si Chen, Jinxing Huo et al
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015, p. 1873-1876
Paper in proceedings
2015

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment

Seung Hee Jeong, Si Chen, Jinxing Huo et al
Scientific Reports. Vol. 5, p. 18257-
Journal article
2015

A High Performance Ag Alloyed Nano-scale n-type Bi2Te3 Based Thermoelectric Material

Si Chen, Nikolaos Logothetis, L. Ye et al
Materials Today: Proceedings. Vol. 2 (2), p. 610-619
Paper in proceedings
2015

Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging

Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability
Journal article
2015

Vertically stacked carbon nanotube-based interconnects for through silicon via application

Di Jiang, Wei Mu, Si Chen et al
IEEE Electron Device Letters. Vol. 36 (5), p. 499-501
Journal article
2015

Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles

Si Chen, Xin Luo, Di Jiang et al
IEEE Transactions on Components, Packaging and Manufacturing Technology. Vol. 5 (8), p. 1186-1196
Journal article
2013

Ultra-short vertically aligned carbon nanofibers transfer and application as bonding material

Si Chen
Soldering and Surface Mount Technology. Vol. 25 (4), p. 242-250
Journal article
2013

Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application

Di Jiang, Teng Wang, Si Chen et al
Microelectronic Engineering. Vol. 103, p. Pages 177-180
Journal article
2012

Development and Characterization of Nano-Composite Solder

Johan Liu, Si Chen, Lilei Ye
Lead-Free Solders: Materials Reliability for Electronics, p. 161-177
Book chapter
2012

Formation of three-dimensional carbon nanotube structures by controllable vapor densification

Teng Wang, Di Jiang, Si Chen et al
Materials Letters. Vol. 78, p. 184-187
Journal article
2012

Selective growth of double-walled carbon nanotubes on gold films

Yifeng Fu, Si Chen, Johan Bielecki et al
Materials Letters. Vol. 72, p. 78-80
Journal article
2012

Reliability investigation of nano-enhanced thermal conductive adhesives

Nan Wang, Murali Murugesan, L. Ye et al
Proceedings of the IEEE Conference on Nanotechnology
Paper in proceedings
2012

TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder

Manman Rui, Xiuzhen Lu, Si Chen et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 203-207
Paper in proceedings
2011

Study on the reliability of fast curing isotropic conductive adhesive

Wenhui Du, Huiwang Cui, Si Chen et al
ECS Transactions. Vol. 34 (1), p. 805 - 810
Paper in proceedings
2011

A highly conductive bimodal isotropic conductive adhesive and its reliability

Dongsheng Li, Huiwang Cui, Si Chen et al
ECS Transactions. Vol. 34 (1), p. 583 - 588
Paper in proceedings
2010

Effects of BN and SiC nanoparticles on properties of conductive adhesive

Huaxiang Lai, Xiuzhen Lu, H. Cui et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582434), p. 235-239
Paper in proceedings
2010

New fast curing isotropic conductive adhesive for electronic packaging application

Wenhui Du, C. Fu, Si Chen et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582446), p. 199-201
Paper in proceedings
2010

Optimization of stiffness for isotropic conductive adhesives

C. Fu, Si Chen, Pär Berggren et al
2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 29-33
Conference contribution
2010

A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles

H. Lai, X. Lu, Si Chen et al
2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 49-53
Conference contribution
2010

Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film

Xia Zhang, Teng Wang, Pär Berggren et al
ECS Transactions. Vol. 27 (1), p. 825-830
Paper in proceedings
2010

Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly

Yifeng Fu, Yiheng Qin, Teng Wang et al
Advanced Materials. Vol. 22 (44), p. 5039-5042
Journal article
2010

Reliability study for high temperature stable conductive adhesives

W. Tao, Si Chen, Pär Berggren et al
2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 74-77
Conference contribution
2009

The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder

Si Chen, Zhaonian Cheng, Johan Liu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1240-1245
Paper in proceedings
2006

Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Si Chen
Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, Shanghai, China
Paper in proceedings
2006

Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Si Chen, Peng Sun, Johan Liu et al
Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, p. 368-373
Paper in proceedings

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