Si Chen

Doktorand at Electronics Material and Systems

Contact Details

Publications (30)
Projects (0)

Showing 30 publications

2017

Stretchable Thermoelectric Generators Metallized with Liquid Alloy

Seung Hee Jeong, Francisco Javier Cruz, Si Chen et al

ACS Applied Materials & Interfaces. Vol. 9 (18), p. 15791-15797

Journal article

2016

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Shuangxi Sun, Si Chen, Xin Luo et al

Microelectronics and Reliability. Vol. 56, p. 129-135

Journal article

Show project

2016

Mechanical characterization ofnanoparticleenhancedSn-3.0Ag-0.5Cu solder

Lilei Ye, Si Chen, Johan Liu

IMAPS Nordic Annual Conference 2016 Proceedings

Paper in proceeding

2015

Characterization of Nanomaterials for Interconnect and Thermal Management in Electronic Packaging

Si Chen

Doctoral thesis

2015

Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging

Shuangxi Sun, Si Chen, Xin Luo et al

Microelectronics and Reliability

Journal article

2015

Vertically stacked carbon nanotube-based interconnects for through silicon via application

Di Jiang, Wei Mu, Si Chen et al

IEEE Electron Device Letters. Vol. 36 (5), p. 499-501

Journal article

Show project

2015

Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles

Si Chen, Xin Luo, Di Jiang et al

IEEE Transactions on Components, Packaging and Manufacturing Technology. Vol. 5 (8), p. 1186-1196

Journal article

2015

Thermal elastomer composites for soft transducers

Seung Hee Jeong, Si Chen, Jinxing Huo et al

2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015, p. 1873-1876

Paper in proceeding

2015

A High Performance Ag Alloyed Nano-scale n-type Bi2Te3 Based Thermoelectric Material

Si Chen, Nikolaos Logothetis, L. Ye et al

Materials Today: Proceedings. Vol. 2 (2), p. 610-619

Paper in proceeding

2015

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment

Seung Hee Jeong, Si Chen, Jinxing Huo et al

Scientific Reports. Vol. 5, p. 18257-

Journal article

2013

Ultra-short vertically aligned carbon nanofibers transfer and application as bonding material

Si Chen

Soldering and Surface Mount Technology. Vol. 25 (4), p. 242-250

Journal article

2013

Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application

Di Jiang, Teng Wang, Si Chen et al

Microelectronic Engineering. Vol. 103, p. Pages 177-180

Journal article

2013

Application of Metallic Nanoparticles and Vertically Aligned Carbon Nanotubes as Interconnect Materials for Electronics Packaging

Si Chen

Licentiate thesis

2012

Development and Characterization of Nano-Composite Solder

Johan Liu, Si Chen, Lilei Ye

Lead-Free Solders: Materials Reliability for Electronics, p. 161-177

Book chapter

2012

Selective growth of double-walled carbon nanotubes on gold films

Yifeng Fu, Si Chen, Johan Bielecki et al

Materials Letters. Vol. 72, p. 78-80

Journal article

2012

Formation of three-dimensional carbon nanotube structures by controllable vapor densification

Teng Wang, Di Jiang, Si Chen et al

Materials Letters. Vol. 78, p. 184-187

Journal article

2012

TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder

Manman Rui, Xiuzhen Lu, Si Chen et al

Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 203-207

Paper in proceeding

2012

Reliability investigation of nano-enhanced thermal conductive adhesives

Nan Wang, Murali Murugesan, L. Ye et al

Proceedings of the IEEE Conference on Nanotechnology

Paper in proceeding

2011

Study on the reliability of fast curing isotropic conductive adhesive

Wenhui Du, Huiwang Cui, Si Chen et al

ECS Transactions. Vol. 34 (1), p. 805 - 810

Paper in proceeding

2011

A highly conductive bimodal isotropic conductive adhesive and its reliability

Dongsheng Li, Huiwang Cui, Si Chen et al

ECS Transactions. Vol. 34 (1), p. 583 - 588

Paper in proceeding

2010

A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles

H. Lai, X. Lu, Si Chen et al

2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 49-53

Other conference contribution

2010

Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film

Xia Zhang, Teng Wang, Pär Berggren et al

ECS Transactions. Vol. 27 (1), p. 825-830

Paper in proceeding

2010

Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly

Yifeng Fu, Yiheng Qin, Teng Wang et al

Advanced Materials. Vol. 22 (44), p. 5039-5042

Journal article

2010

Effects of BN and SiC nanoparticles on properties of conductive adhesive

Huaxiang Lai, Xiuzhen Lu, H. Cui et al

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582434), p. 235-239

Paper in proceeding

2010

New fast curing isotropic conductive adhesive for electronic packaging application

Wenhui Du, C. Fu, Si Chen et al

Paper in proceeding

2010

Optimization of stiffness for isotropic conductive adhesives

C. Fu, Si Chen, Pär Berggren et al

2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 29-33

Other conference contribution

2010

Reliability study for high temperature stable conductive adhesives

W. Tao, Si Chen, Pär Berggren et al

2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 74-77

Other conference contribution

2009

The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder

Si Chen, Zhaonian Cheng, Johan Liu et al

Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1240-1245

Paper in proceeding

2006

Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Si Chen, Peng Sun, Johan Liu et al

Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, p. 368-373

Paper in proceeding

2006

Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Si Chen

Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, Shanghai, China

Paper in proceeding

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