Vertically stacked carbon nanotube-based interconnects for through silicon via application
Journal article, 2015
transfer
through-silicon via (TSV)
densification
Carbon nanotube (CNT)
interconnect
3D stacking
Author
Di Jiang
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Wei Mu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Si Chen
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Yifeng Fu
SHT Smart High-Tech
Kjell Jeppson
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
IEEE Electron Device Letters
0741-3106 (ISSN)
Vol. 36 5 499-501Carbon Based Smart Systems for Wireless Applications (NANO RF)
European Commission (FP7), 2012-09-01 -- 2015-08-31.
Areas of Advance
Nanoscience and Nanotechnology (2010-2017)
Production
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
Nano Technology
Infrastructure
Nanofabrication Laboratory
DOI
10.1109/LED.2015.2415198