Di Jiang

Doktorand at Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Projects

2014–2015

Development of Graphene-based nuclear fuel cladding for improved safety.

Victor Dykin Nuclear Engineering
Di Jiang Electronics Material and Systems Laboratory
Henrik Nylén Nuclear Engineering
Mattias Thuvander Materials Microstructure
ÅForsk (Ångpanneföreningens Foundation for Research and Development)

There might be more projects where Di Jiang participates, but you have to be logged in as a Chalmers employee to see them.

Publications

2017

Test structures for studying flexible interconnect supported by carbon nanotube scaffolds

Kjell Jeppson, Di Jiang, Shuangxi Sun et al
International Conference on Microelectronic Test Structures. Vol. 2017
Paper in proceedings
2017

A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Kjell Jeppson, Di Jiang, Shuangxi Sun et al
Flexible and Printed Electronics. Vol. 2 (2), p. 025003-
Journal article
2016

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Di Jiang, Nan Wang, Michael Edwards et al
Small. Vol. 12 (11), p. 1521-1526
Journal article
2015

Flexible Multi-functionalized Carbon Nanotubes Based Hybrid Nanowires

Nan Wang, Di Jiang, Lilei Ye et al
Advanced Materials for Optics and Electronics
Journal article
2015

Flexible Multifunctionalized Carbon Nanotubes-Based Hybrid Nanowires

Nan Wang, Di Jiang, L. Ye et al
Advanced Materials for Optics and Electronics. Vol. 25 (26), p. 4135-4143
Journal article
2015

Chemically enhanced carbon nanotubes based Thermal Interface Materials

J. Daon, Shuangxi Sun, Di Jiang et al
Conference contribution
2015

Vertically stacked carbon nanotube-based interconnects for through silicon via application

Di Jiang, Wei Mu, Si Chen et al
IEEE Electron Device Letters. Vol. 36 (5), p. 499-501
Journal article
2015

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Wei Mu, Shuangxi Sun, Di Jiang et al
Journal of Electronic Materials. Vol. 2015 (17 April), p. http://dx.doi.org/10.1007/s11664-015-3752-2-
Journal article
2015

Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles

Si Chen, Xin Luo, Di Jiang et al
IEEE Transactions on Components, Packaging and Manufacturing Technology. Vol. 5 (8), p. 1186-1196
Journal article
2014

Reliability of carbon nanotube bumps for chip on glass application

X. Fan, X. Li, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962753-
Paper in proceedings
2014

A solder joint structure with vertically aligned carbon nanofibres as reinforcements

S. Chen, Di Jiang, L. Ye et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962851-
Paper in proceedings
2014

Carbon nanotube/solder hybrid structure for interconnect applications

Di Jiang, Shuangxi Sun, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962751-
Paper in proceedings
2014

CHEMICALLY VAPOR DEPOSITED CARBON NANOTUBES FOR VERTICAL ELECTRONICS INTERCONNECT IN PACKAGING APPLICATIONS

Johan Liu, Yifeng Fu, Di Jiang
Proceedings of the 12th international conference on Solid States and Integrated Circuits, ICSICT2014, p. 47-50
Paper in proceedings
2013

Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration

Johan Liu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (1), p. 13-27
Journal article
2013

Experimental study of Electrical properties and stability of CNT bumps in high density interconnects

Yan Zhang, Yingjie Zhou, Jingyu Fan et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 1085-1088
Paper in proceedings
2013

Controlling the Density of CNTs by Different UnderlayerMaterials in PECVD Growth

Liang Xu, Di Jiang, Yifeng Fu et al
Proceedings of the 19th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems, September 25-27 2013, Berlin, Germany, IEEE / Therminic 2013, p. 248-252
Paper in proceedings
2013

Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD

Liang Xu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (3), p. 236-240
Journal article
2013

Reliability of Carbon Nanotube Bumps for Chip on Film Application

X. Li, Wei Mu, Di Jiang et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 845-848
Paper in proceedings
2012

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

Kjell Jeppson, Teng Wang, Di Jiang et al
IEEE Electron Device Letters. Vol. 33 (3), p. 420-422
Journal article
2012

Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler

Yan Zhang, Huifeng Lv, Jing-yu Fan et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 1573-1577
Paper in proceedings
2012

Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate

Di Jiang, Yifeng Fu, Yan Zhang et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, Budapest, 25-27 September 2012, p. 213-216
Paper in proceedings
2012

Formation of three-dimensional carbon nanotube structures by controllable vapor densification

Teng Wang, Di Jiang, Si Chen et al
Materials Letters. Vol. 78, p. 184-187
Journal article
2012

Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application

Di Jiang, Teng Wang, Si Chen et al
Microelectronic Engineering. Vol. 103, p. Pages 177-180
Journal article
2012

Electrical Interconnects Made of Carbon Nanotubes: Applications in 3D Chip Stacking

Di Jiang, Lilei Ye, Kjell Jeppson et al
IMAPS Nordic Annual Conference Proceedings 2012, Helsingor, 2 - 4 September 2012, p. 150-159
Paper in proceedings
2012

Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology

Di Jiang, Teng Wang, Lilei Ye et al
ECS Transactions. Vol. 44 (1), p. 683-692
Paper in proceedings