Carbon nanotube/solder hybrid structure for interconnect applications
Paper in proceedings, 2014

A carbon nanotube (CNT)/Solder hybrid bump structure is proposed in this work in order to overcome the drawbacks of high CNT resistivity while retaining the advantages of CNTs in terms of interconnect reliability. Lithographically defined hollow CNT moulds are grown by thermal chemical vapor deposition (TCVD). The space inside the CNT moulds is filled up with Sn-Au-Cu (SAC) solder spheres of around 10 μm in diameter. This CNT/Solder hybrid material is then reflowed and transferred onto target indium coated substrate. The reflow melts the small solder spheres into large single solder balls thus forming a hybrid interconnect bump together with the surrounding densified CNT walls, which the CNT and the solder serve as resistors in parallel. The electrical resistance of such a CNT/Solder structure is measured to be around 6 folds lower than pure CNT bumps.

Author

Di Jiang

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Shuangxi Sun

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Wei Mu

Shanghai University

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Yifeng Fu

SHT Smart High-Tech

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014

Art. no. 6962751-

Subject Categories

Nano Technology

DOI

10.1109/ESTC.2014.6962751

ISBN

978-147994026-4

More information

Latest update

12/13/2018