Wei Mu

Doktorand at Electronics Material and Systems

Contact Details

Publications (21)
Projects (0)

Showing 21 publications

2018

Understanding noninvasive charge transfer doping of graphene: a comparative study

Ankit Nalin Mehta, Wei Mu, Murali Murugesan et al

Journal of Materials Science: Materials in Electronics. Vol. 29 (7), p. 5239-5252

Journal article

2016

Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation

Xin Luo, J. C. Peng, Carl Zandén et al

Acta Materialia. Vol. 104, p. 109-118

Journal article

2016

Carbon nanotube growth on different underlayers for thermal interface material application

Yifeng Fu, Shuangxi Sun, Wei Mu et al

IMAPS Nordic Annual Conference 2016 Proceedings

Paper in proceeding

2016

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Di Jiang, Nan Wang, Michael Edwards et al

Small. Vol. 12 (11), p. 1521-1526

Journal article

Show project

2016

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Shuangxi Sun, Wei Mu, Michael Edwards et al

Nanotechnology. Vol. 27 (33), p. Art no335705-

Journal article

2016

3D Integration of Carbon Based Electronics

Wei Mu

Doctoral thesis

2016

Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review

Yifeng Fu, Wei Mu, Shuangxi Sun et al

2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764713-

Paper in proceeding

2016

Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

Wei Mu, Josef Hansson, Shuangxi Sun et al

Proceedings - Electronic Components and Technology Conference. Vol. 2016-August, p. 211-216

Paper in proceeding

2016

Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes

Wei Mu, Eun-Hye Kwak, Bingan Chen et al

Electronic Materials Letters. Vol. 12 (3), p. 329-337

Journal article

Show project

2016

Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives

Nan Wang, Nikolaos Logothetis, Wei Mu et al

2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764682-

Paper in proceeding

2016

Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor

Wei Mu, Yifeng Fu, Michael Edwards et al

IMAPS Nordic Annual Conference 2016 Proceedings

Paper in proceeding

2016

Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

Wei Mu, Yifeng Fu, Shuangxi Sun et al

Chemical Engineering Journal. Vol. 304 (15 November 2016), p. 106-114

Journal article

Show project

2015

Unusual tensile behavior of fiber-reinforced indium matrix composite and its in-situ TEM straining observation

Xin Luo, Jianchao Peng, Carl Zandén et al

Acta Materialia

Journal article

2015

Cooling hot spots by hexagonal boron nitride heat spreaders

Shuangxi Sun, Jie Bao, Wei Mu et al

Proceedings - Electronic Components and Technology Conference. Vol. 2015-July, p. 1658-1663

Paper in proceeding

2015

Vertically stacked carbon nanotube-based interconnects for through silicon via application

Di Jiang, Wei Mu, Si Chen et al

IEEE Electron Device Letters. Vol. 36 (5), p. 499-501

Journal article

Show project

2015

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Wei Mu, Shuangxi Sun, Di Jiang et al

Journal of Electronic Materials. Vol. 44 (8), p. 2898-2907

Journal article

2015

Towards 3D Integration of Carbon Based Electronics

Wei Mu

Licentiate thesis

2014

Carbon nanotube/solder hybrid structure for interconnect applications

Di Jiang, Shuangxi Sun, Wei Mu et al

Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962751-

Paper in proceeding

2014

Reliability of carbon nanotube bumps for chip on glass application

X. Fan, X. Li, Wei Mu et al

Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962753-

Paper in proceeding

2013

Reliability of Carbon Nanotube Bumps for Chip on Film Application

X. Li, Wei Mu, Di Jiang et al

Proceedings of the IEEE Conference on Nanotechnology, p. 845-848

Paper in proceeding

2012

Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material

Shuangxi Sun, Wei Mu, Yan Zhang et al

Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging (Article number 6474593), p. 171-176

Paper in proceeding

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