Carbon nanotube growth on different underlayers for thermal interface material application
Paper in proceeding, 2016

Thermal interface material (TIM) is a critical component in thermal management of high density packaging systems since both the reliability and lifetime of microsystems are dependent on how the heat is dissipated. Carbon nanotubes (CNTs) are promising candidate for development of TIMs due to their excellent thermal and mechanical properties. The thermal conductivity of CNTs can be up to 3000 W/mK in the longitudinal direction which acts as ideal heat transfer path. However, the huge interfacial thermal resistance between CNTs and contact surface hinders the exploitation of CNTs as TIMs. In this paper, we will focus on the growth of CNTs on various substrates and underlayers and analyze the interaction between catalyst and underlayer materials. Microscopic analysis is performed to characterize the quality of the CNT materials and monitor the diffusion of Fe particles into different barrier layers. Thermal conductivity of the CNT TIMs will be measured to examine the performance of the materials.

Author

Yifeng Fu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems

Shuangxi Sun

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems

Wei Mu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems

Lilei Ye

SHT Smart High-Tech

E.M. Leveugle

Thales Group

A. Ziaei

Thales Group

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems

IMAPS Nordic Annual Conference 2016 Proceedings


9781510827226 (ISBN)

Subject Categories

Materials Engineering

ISBN

9781510827226

More information

Latest update

3/25/2020