Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects
Journal article, 2016
CNT-Cu
nanocomposite
TSV
3D-IC
Author
Shuangxi Sun
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Wei Mu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Michael Edwards
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Davide Mencarelli
Marche Polytechnic University
Luca Pierantoni
Marche Polytechnic University
Yifeng Fu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Kjell Jeppson
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Nanotechnology
0957-4484 (ISSN) 1361-6528 (eISSN)
Vol. 27 33 Art no335705-Subject Categories
Materials Engineering
Areas of Advance
Production
Materials Science
DOI
10.1088/0957-4484/27/33/335705