Michael Edwards

Showing 28 publications

2017

A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Di Jiang, Shuangxi Sun, Michael Edwards et al
Flexible and Printed Electronics. Vol. 2 (2)
Journal article
2017

Efficient surface modification of carbon nanotubes for fabricating high performance CNT based hybrid nanostructures

Nan Wang, Santosh Pandit, L. Ye et al
Carbon. Vol. 111, p. 402-410
Journal article
2017

Test structures for studying flexible interconnect supported by carbon nanotube scaffolds

Kjell Jeppson, Di Jiang, Shuangxi Sun et al
IEEE International Conference on Microelectronic Test Structures. Vol. 2017
Paper in proceeding
2017

Chemical vapor deposition grown graphene on Cu-Pt alloys

Yong Zhang, Yifeng Fu, Michael Edwards et al
Materials Letters. Vol. 193, p. 255-258
Journal article
2016

Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation

Xin Luo, J. C. Peng, Carl Zandén et al
Acta Materialia. Vol. 104, p. 109-118
Journal article
2016

Functionalization mediates heat transport in graphene nanoflakes

H. X. Han, Yong Zhang, Nan Wang et al
Nature Communications. Vol. 7
Journal article
2016

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Shuangxi Sun, Wei Mu, Michael Edwards et al
Nanotechnology. Vol. 27 (33), p. Art no335705-
Journal article
2016

Design and Fabrication of a SiC-Based Power Module with Double-Sided Cooling for Automotive Applications

K. Brinkfeldt, Jonas Ottosson, Klaus Neumaier et al
Lecture Notes in Mobility, p. 157-171
Book chapter
2016

Finite element simulation of 2D-based materials as heat spreaders

Michael Edwards, Yong Zhang, Jie Bao et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceeding
2016

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Di Jiang, Nan Wang, Michael Edwards et al
Small. Vol. 12 (11), p. 1521-1526
Journal article
2016

2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS

Yong Zhang, S. Huang, Nan Wang et al
China Semiconductor Technology International Conference 2016, CSTIC 2016
Paper in proceeding
2016

Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

Wei Mu, Josef Hansson, Shuangxi Sun et al
Proceedings - Electronic Components and Technology Conference. Vol. 2016-August, p. 211-216
Paper in proceeding
2016

Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications

Yong Zhang, Michael Edwards, Kabir Majid Samani et al
Carbon. Vol. 106, p. 195-201
Journal article
2016

Graphene-based heater

Yong Zhang, Michael Edwards, Yifeng Fu et al
IMAPS Nordic Annual Conference 2016; Tonsberg; Norway; 5-7 June 2016
Paper in proceeding
2016

Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes

Wei Mu, Eun-Hye Kwak, Bingan Chen et al
Electronic Materials Letters. Vol. 12 (3), p. 329-337
Journal article
2016

Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing

Jie Bao, Kjell Jeppson, Michael Edwards et al
Electronic Materials Letters. Vol. 12 (1), p. 1-16
Review article
2016

Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging

Jie Bao, Michael Edwards, Shirong Huang et al
Journal of Physics D: Applied Physics. Vol. 49 (July 2016), p. 265501-
Journal article
2016

Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor

Wei Mu, Yifeng Fu, Michael Edwards et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceeding
2016

Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

Wei Mu, Yifeng Fu, Shuangxi Sun et al
Chemical Engineering Journal. Vol. 304 (15 November 2016), p. 106-114
Journal article
2015

Flexible Multi-functionalized Carbon Nanotubes Based Hybrid Nanowires

Nan Wang, Di Jiang, Lilei Ye et al
Advanced Functional Materials
Journal article
2015

Thermo-Mechanical Simulations of SiC Power Modules with Single and Double Sided Cooling

Klas Brinkfelt, Michael Edwards, Jonas Ottosson et al
16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015, p. 1 - 7
Paper in proceeding
2015

Unusual tensile behavior of fiber-reinforced indium matrix composite and its in-situ TEM straining observation

Xin Luo, Jianchao Peng, Carl Zandén et al
Acta Materialia
Journal article
2015

Flexible Multifunctionalized Carbon Nanotubes-Based Hybrid Nanowires

Nan Wang, Di Jiang, L. Ye et al
Advanced Functional Materials. Vol. 25 (26), p. 4135-4143
Journal article
2015

The shear strength of nano-Ag sintered joints and the use of Ag interconnects in the design and manufacture of SiGe-based thermo-electric modules

Michael Edwards, K. Brinkfeldt, U. Rusche et al
Microelectronics and Reliability. Vol. 55 (5), p. 722-732
Journal article
2015

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Wei Mu, Shuangxi Sun, Di Jiang et al
Journal of Electronic Materials. Vol. 44 (8), p. 2898-2907
Journal article
2015

Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application

Yong Zhang, H. X. Han, Nan Wang et al
Advanced Functional Materials. Vol. 25 (28), p. 4430-4435
Journal article
2015

Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles

Si Chen, Xin Luo, Di Jiang et al
IEEE Transactions on Components, Packaging and Manufacturing Technology. Vol. 5 (8), p. 1186-1196
Journal article
2015

Model verification of heat exchangers in a flow test rig

K. Brinkfeldt, Thorbjörn Åklint, Klaus Neumaier et al
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015, p. 7103135-
Paper in proceeding

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