Design and Fabrication of a SiC-Based Power Module with Double-Sided Cooling for Automotive Applications
Book chapter, 2016

The electrification of drive trains combined with special requirements of the automotive and heavy construction equipment applications drives the development of small, highly integrated and reliable power inverters. To minimize the volume and increase the reliability of the power switching devices a module consisting of SiC devices with double sided cooling capability has been developed. There are several benefits related to cooling the power devices on both sides. The major improvement is the ability to increase the power density, and thereby reduce the number of active switching devices required which in turn reduces costs. Other expected benefits of more efficient cooling are reductions in volume and mass per power ratio. Alternatively, improved reliability margins due to lower temperature swings during operation are can be expected. Removing the wire bonds on the top side of the devices is expected to improve the reliability regardless, since wire bonds are known to be one of the main limitations in power switching devices. In addition, it is possible to design the package with substantially lower inductance, which can allow faster switching of the devices. In this paper the design, simulations and fabrication process of a double sided SiC-based power module are presented.

Double-sided cooling

Power electronics

Silicon carbide

FE-simulation

Packaging

Author

K. Brinkfeldt

Swerea

Jonas Ottosson

Volvo Group

Klaus Neumaier

Fairchild Semiconductor GmbH

Olaf Zschieschang

Fairchild Semiconductor GmbH

Eberhard Kaulfersch

Berliner Nanotest und Design GmbH

Michael Edwards

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems

Alexander Otto

Fraunhofer-Institut fur Elektronische Nanosysteme

Dag Andersson

Swerea

Lecture Notes in Mobility

21965544 (ISSN) 21965552 (eISSN)

157-171

Subject Categories

Aerospace Engineering

Energy Engineering

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1007/978-3-319-20855-8_13

More information

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1/3/2024 9