Design and Fabrication of a SiC-Based Power Module with Double-Sided Cooling for Automotive Applications
Book chapter, 2016
Double-sided cooling
Power electronics
Silicon carbide
FE-simulation
Packaging
Author
K. Brinkfeldt
Swerea
Jonas Ottosson
Volvo Group
Klaus Neumaier
Fairchild Semiconductor GmbH
Olaf Zschieschang
Fairchild Semiconductor GmbH
Eberhard Kaulfersch
Berliner Nanotest und Design GmbH
Michael Edwards
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Alexander Otto
Fraunhofer-Institut fur Elektronische Nanosysteme
Dag Andersson
Swerea
Lecture Notes in Mobility
21965544 (ISSN) 21965552 (eISSN)
157-171Subject Categories
Aerospace Engineering
Energy Engineering
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1007/978-3-319-20855-8_13