2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS

Paper in proceeding, 2016

The need for faster and smaller, as well as more reliable and efficient consumer electronic products has resulted in microelectronic components that produce progressively more heat. The resultant reliability issues from the increased heat flux are serious and hinder technological development. One solution for microelectronics cooling applications is 2D materials applied as heat spreaders and these include monolayer graphene, graphene based films, and monolayer hexagonal boron nitride and BN based films. In addition, thermal performances of the graphene heat spreader were also studied under different packaging structures, including wire bonding, cooling fins and flip chips. Finally, 2D hexagonal Boron nitride (h-BN) heat spreaders, fabricated by different methods, had their heat dissipation performances characterized by different thermal characterization methods, such as resistance temperature detector (RTD) and Infrared (IR) methods. In conclusion, these new novel 2D materials developed show great potential for microelectronics cooling applications.