Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications
Journal article, 2015
resistivity
polymer filling
TSV
Carbon nanotube bundles
postgrowth transfer
Author
Wei Mu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Shuangxi Sun
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Di Jiang
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Yifeng Fu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Michael Edwards
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Yong Zhang
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Kjell Jeppson
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Journal of Electronic Materials
0361-5235 (ISSN)
Vol. 2015 17 April http://dx.doi.org/10.1007/s11664-015-3752-2-Areas of Advance
Nanoscience and Nanotechnology (2010-2017)
Roots
Basic sciences
Subject Categories
Nano Technology
Infrastructure
Nanofabrication Laboratory
DOI
10.1007/s11664-015-3752-2