Reliability of Carbon Nanotube Bumps for Chip on Film Application
Paper in proceedings, 2013
Author
X. Li
Shanghai University
Wei Mu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Di Jiang
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Yifeng Fu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Yan Zhang
Shanghai University
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Proceedings of the 13th IEEE International Conference on Nanotechnology
1944-9380 (eISSN)
845-848Areas of Advance
Nanoscience and Nanotechnology (2010-2017)
Subject Categories
Nano Technology
DOI
10.1109/NANO.2013.6720993
ISBN
978-1-4799-0675-8