Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review
Paper in proceedings, 2016

Interconnect is one of the most important functions of packaging technology. It delivers power and signals into and out of electronic systems. The performance and reliability of microsystems are dependent on the interconnect quality. This paper reviews the chip-level interconnects based on carbon nanotubes (CNTs), this includes their applications for both on-chip and off-chip interconnects. Various post-growth processing of CNTs, such as doping, densification, transfer, metallization, etc., for the improvement of their performance will be reviewed.

Author

Yifeng Fu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Wei Mu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Shuangxi Sun

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

N. Wang

Shanghai University

S. Huang

Shanghai University

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

2016 6th Electronic System-Integration Technology Conference (Estc)

Article no 7764713-

Subject Categories

Computer Engineering

DOI

10.1109/ESTC.2016.7764713

ISBN

978-150901402-6

More information

Latest update

9/21/2018