Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review
Paper i proceeding, 2016

Interconnect is one of the most important functions of packaging technology. It delivers power and signals into and out of electronic systems. The performance and reliability of microsystems are dependent on the interconnect quality. This paper reviews the chip-level interconnects based on carbon nanotubes (CNTs), this includes their applications for both on-chip and off-chip interconnects. Various post-growth processing of CNTs, such as doping, densification, transfer, metallization, etc., for the improvement of their performance will be reviewed.

Författare

Yifeng Fu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Wei Mu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Shuangxi Sun

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

N. Wang

Shanghai University

S. Huang

Shanghai University

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

2016 6th Electronic System-Integration Technology Conference (Estc)

Article no 7764713-

Ämneskategorier

Datorteknik

DOI

10.1109/ESTC.2016.7764713

ISBN

978-150901402-6

Mer information

Senast uppdaterat

2018-09-21