Shuangxi Sun
Visar 28 publikationer
Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds
A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds
Test structures for studying flexible interconnect supported by carbon nanotube scaffolds
Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics
Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects
Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review
Carbon nanotube growth on different underlayers for thermal interface material application
Application of two-dimensional layered hexagonal boron nitride in chip cooling
2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS
Heat dissipation of a hybrid CNT/Graphene based heat spreader
Thermal properties of TIM using CNTs forest in electronics packaging
Cooling hot spots by hexagonal boron nitride heat spreaders
Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications
Chemically enhanced carbon nanotubes based Thermal Interface Materials
Characterization of Nanoscale Materials for 3D IC Interconnect and Heat Dissipation Applications
Carbon nanotube/solder hybrid structure for interconnect applications
Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology
Characterization for Graphene as Heat Spreader Using Thermal Imaging Method
Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material
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