Shuangxi Sun

Doktorand vid Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Visar 29 publikationer

2018

Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds

Majid Kabiri Samani, Shuangxi Sun, Yifeng Fu et al
Advanced Materials Interfaces. Vol. 2018 (5)
Artikel i vetenskaplig tidskrift
2018

Anisotropic thermal conductivity of vertically self-ordered Nanocrystalline Boron Nitride thin films for thermal hotspot mitigation in electronics

S. H. Tsang, O. Cometto, Majid Kabiri Samani et al
2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018 - Proceedings, p. 25-27
Paper i proceeding
2017

Evaluating CNT-Based Interconnects : A Nummerical Tool to Characterize Hybrid CNT-Copper Interconnects

Silvia Bistarelli, Shuangxi Sun, Luca Pierantoni et al
IEEE Microwave Magazine. Vol. 18 (4), p. 124-129
Artikel i vetenskaplig tidskrift
2017

Test structures for studying flexible interconnect supported by carbon nanotube scaffolds

Kjell Jeppson, Di Jiang, Shuangxi Sun et al
International Conference on Microelectronic Test Structures. Vol. 2017
Paper i proceeding
2017

A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Di Jiang, Shuangxi Sun, Michael Edwards et al
Flexible and Printed Electronics. Vol. 2 (2)
Artikel i vetenskaplig tidskrift
2016

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability. Vol. 56, p. 129-135
Artikel i vetenskaplig tidskrift
2016

2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS

Yong Zhang, S. Huang, Nan Wang et al
China Semiconductor Technology International Conference (CSTIC) (Shanghai, March 13-14)
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2016

Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

Wei Mu, Yifeng Fu, Shuangxi Sun et al
Chemical Engineering Journal. Vol. 304 (15 November 2016), p. 106-114
Artikel i vetenskaplig tidskrift
2016

Carbon nanotube growth on different underlayers for thermal interface material application

Yifeng Fu, Shuangxi Sun, Wei Mu et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2016

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Shuangxi Sun, Wei Mu, Michael Edwards et al
Nanotechnology. Vol. 27 (33), p. Art no335705-
Artikel i vetenskaplig tidskrift
2016

Heat dissipation of a hybrid CNT/Graphene based heat spreader

Shuangxi Sun, Peng Su, Nan Wang et al
IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016
Paper i proceeding
2016

Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders

Kjell Jeppson, Jie Bao, S. Huang et al
29th IEEE International Conference on Microelectronic Test Structures (ICMTS), Yokohama, Japan, Mar 28-31, 2016, p. 32-36
Paper i proceeding
2016

Thermal properties of TIM using CNTs forest in electronics packaging

Dongsheng Zhang, Johan Liu, Shuangxi Sun et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016; Wuhan Optics Valley Kingdom Hotel Wuhan; China; 16 August 2016 through 19 August 2016, p. 1355-1359
Paper i proceeding
2016

Thermal conductivity measurement of densified carbon nanotube bundles by pulsed photothermal reflectance technique

Majid Kabiri Samani, Shuangxi Sun, Yifeng Fu et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2016

Application of two-dimensional layered hexagonal boron nitride in chip cooling

Jie Bao, Y. Zhang, S. Huang et al
Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering. Vol. 24 (1), p. 210-217
Artikel i övriga tidskrifter
2016

Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review

Yifeng Fu, Wei Mu, Shuangxi Sun et al
2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764713-
Paper i proceeding
2016

Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

Wei Mu, Josef Hansson, Shuangxi Sun et al
66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, USA, May 31-Jun 03, 2016, p. 211-216
Paper i proceeding
2016

Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor

Wei Mu, Yifeng Fu, Shuangxi Sun et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2015

Cooling hot spots by hexagonal boron nitride heat spreaders

Shuangxi Sun, Jie Bao, Wei Mu et al
2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015, San Diego, United States, 26-29 May 2015, p. 1658-1663
Paper i proceeding
2015

Chemically enhanced carbon nanotubes based Thermal Interface Materials

J. Daon, Shuangxi Sun, Di Jiang et al
2015 21st International Workshop on Thermal Investigations of Ics and Systems (Therminic)
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2015

Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging

Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability
Artikel i vetenskaplig tidskrift
2015

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Wei Mu, Shuangxi Sun, Di Jiang et al
Journal of Electronic Materials. Vol. 2015 (17 April), p. http://dx.doi.org/10.1007/s11664-015-3752-2-
Artikel i vetenskaplig tidskrift
2014

Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats

J. Daon, Shuangxi Sun, Di Jiang et al
IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014
Paper i proceeding
2014

Carbon nanotube/solder hybrid structure for interconnect applications

Di Jiang, Shuangxi Sun, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962751-
Paper i proceeding
2013

Characterization for Graphene as Heat Spreader Using Thermal Imaging Method

Shirong Huang, Yong Zhang, Shuangxi Sun et al
Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT), p. 403-408
Paper i proceeding
2013

Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology

Shirong Huang, Yong Zhang, Shuangxi Sun et al
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), p. 347-352
Paper i proceeding
2012

Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material

Shuangxi Sun, Wei Mu, Yan Zhang et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging (Article number 6474593), p. 171-176
Paper i proceeding

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