Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging
Artikel i vetenskaplig tidskrift, 2016

This paper presents a novel nanocomposite thermal interface material (Nano-TIM) consisting of a silver coated polyimide network and the indium matrix. One of the potential applications of this Nano-TIM is for heat dissipation in integrated circuits and electronic packaging. The shear strength of the Nano-TIM was investigated with DAGE-4000PSY shear tester. The shear strength of Nano-TIM is 4.5 MPa, which is 15% higher than that of the pure indium thermal interface material. The microstructure of cross-section and fracture surface was studied using Scanning Electron Microscopy (SEM). SEM pictures show a uniform polymer fiber distribution and solid interface between silver coated fibers and indium matrix. The thermal fatigue resistance of the Nano-TIM was evaluated by monitoring the variation of thermal interface resistance during the thermal cycling test (-40 to 125 degrees C). The thermal interface resistance was measured with a commercial xenon flash instrument after 100, 200, 300, 400, 500, and 1000 temperature cydes. The results-of thermal cycling test show that Nano-TIM presented consistent reliability performance with pure indium. Furthermore, the tooling effect of Nano-TIM was demonstrated through measuring the power chip temperature in the die attached structure by using an Infrared Camera. In the test, the Nano-TIM shows a comparable cooling effect to pure indium TIM for die attach applications in electronics packaging.

Microelectronic packaging

Nano-fiber

Nano-TIM

Författare

Shuangxi Sun

Elektronikmaterial och system

Si Chen

Elektronikmaterial och system

Xin Luo

Elektronikmaterial och system

Yifeng Fu

Elektronikmaterial och system

L. Ye

SHT Smart High Tech AB

Johan Liu

Elektronikmaterial och system

Microelectronics and Reliability

0026-2714 (ISSN)

Vol. 56 129-135

Styrkeområden

Produktion

Ämneskategorier

Nanoteknik

DOI

10.1016/j.microrel.2015.10.028